육성한 화단국화 품종인 황색 국화(Chrysanthemum morifolium Ramat.)인 ‘한아름볼(Hanarum Ball)’은 충남농업기술원 화훼 연구소에서 모본 ‘Gigi Gold’와 부본 ‘Jinny Ball’을 이용하여 육성되었다. ‘한아름볼’ 품종은 2014년에 인공 교배를 통해 개 발되었으며, 2015년부터 2017년까지 품종 특성을 조사한 후 2017년에 최종 선발되었다. ‘한아름볼’의 초형은 반구형으로, 노랑색 꽃잎(Yellow 5B)을 가진 반겹꽃을 지니고 있으며, 개화 기는 9월 21일이다. 초장은 36.0cm로, 초폭은 66.0cm, 화폭 은 4.1cm, 본당 착화수는 1,147개, 꽃잎수는 81.0개이며, 엽색 은 녹색(Green 137B)이어서, 대조품종인 ‘금방울’과 유사한 형 태와 색을 가지고 있으나, 꽃크기와 착화수, 개화시기에서 차이 를 보였다. ‘한아름볼’은 도로변이나 화단 등 조경용으로 활용 가능하며, 화훼 농가에 새로운 소득원을 제공할 수 있는 품종으 로 기대된다.

Companies are paying attention to project governance to realize their goal strategies, project success, and project value in a rapid and complex environment due to the development of information technology. This study aims to explore project governance and factors from literature review and practice guides related to project governance and empirically analyze the impact of project governance factors on IT project objective performance. The survey was conducted on project managers, project team members, and project management members with experience in carrying out business IT projects within two years at companies in various industries in Korea. The main conclusion is as follows. Among the project governance factors, disclosure and reporting that uses and reports using appropriate and reliable information about projects related to decision-making activities positively impact the achievement of IT project objectives: business success and stakeholder satisfaction. Among the project governance factors, project sponsorship, a role that effectively connects management and projects, and a project management framework that provides tools, procedures, resources, and techniques for projects positively impact IT project objective performance. This study is of academic and practical significance in that it identifies the definition and factors of project governance through companies in various industries in Korea and the positive impact of project governance factors on IT project objective performance.

Recently, metal cases are widely used in smart phones for their luxurious color and texture. However, when a metal case is used, electric shock may occur during charging. Chip capacitors of various values are used to prevent the electric shock. However, chip capacitors are vulnerable to electrostatic discharge(ESD) generated by the human body, which often causes insulation breakdown during use. This breakdown can be eliminated with a high-voltage chip varistor over 340V, but when the varistor voltage is high, the capacitance is limited to about 2pF. If a chip capacitor with a high dielectric constant and a chip varistor with a high voltage can be combined, it is possible to obtain a new device capable of coping with electric shock and ESD with various capacitive values. Usually, varistors and capacitors differ in composition, which causes different shrinkage during co-firing, and therefore camber, internal crack, delamination and separation may occur after sintering. In addition, varistor characteristics may not be realized due to the diffusion of unwanted elements into the varistor during firing. Various elements are added to control shrinkage. In addition, a buffer layer is inserted in the middle of the varistor-capacitor junction to prevent diffusion during firing, thereby developing a co-fired product with desirable characteristics.