The purpose of this study is to develop an electroless nickel plating process suitable for IXEF 1022, which is a high-performance polymer, and to analyze the effect of plating temperature on plating quality in particular. The experiment was conducted at 80°C, 83°C, and 85°C, and as a result, it was confirmed that as the temperature increased, the thickness and external dimensions of the plating layer gradually increased, and the plating layer tended to be uniformly formed on the entire surface. In addition, the adhesion and quality of the plating layer were maintained stably even at high temperatures, which proves the practicality and reliability of the process. These results contribute to the improvement of the conductivity and durability of IXEF 1022, and suggest the possibility of application in various industrial fields such as electronics, automobiles, and medical devices.