Cu-Ti thin films were fabricated using a combinatorial sputtering system to realize highly sensitive surface acoustic wave (SAW) devices. The Cu-Ti sample library was grown with various chemical compositions and electrical resistivity, providing important information for selecting the most suitable materials for SAW devices. Considering that acoustic waves generated from piezoelectric materials are significantly affected by the resistivity and density of interdigital transducer (IDT) electrodes, three types of Cu-Ti thin films with different Cu contents were fabricated. The thickness of the Cu-Ti thin films used in the SAW-IDT electrode was fixed at 150 nm. As the Cu content of the Cu-Ti films was increased from 31.2 to 71.3 at%, the resistivity decreased from 10.5 to 5.8 × 10-5 ohm-cm, and the density increased from 5.5 to 7.3 g/cm3, respectively. A SAW device composed of Cu-Ti IDT electrodes resonated at exactly 143 MHz without frequency shifts, but the full width at half maximum (FWHM) values of the resonant frequency gradually increased as the Cu content increased. This means that although the increase in Cu content in the Cu-Ti thin film helps to improve the electrical properties of the IDT electrode, the increased density of the IDT electrode deteriorates the acoustic performance of SAW devices.

본 논문에서는 새로운 구조의 사각 링과 깍지 낀 용량성 급전구조를 이용한 마이크로스트립 패치 대역통과필터를 설계 및 제작하였다. 필터의 크기를 줄이고 IEEE 802. 11에 부합하는 Wireless LAM영역(2.45GHz and 5.2GHz)에서 동작할 수 있도록 하기 위해서 패치 구조에 서 변형된 사각 링과 깍지 낀 용량성 급전구조를 적용하였다. 그 결과 설계와 제작이 간단하여 RF(Radio Frequency) 필터로 많이 사용되고 있는 병렬 끝단 결합 마이크로스트립 대역통과필터(Parallel Edge-coupled Microstrip Bandpass Filter)의 최소 단수로 계산되어진 회로에 비하여 60%이상의 크기 감소 효과를 가져왔다. 제작된 필터의 측정 결과, 중심주파수는 2.408GHz와 5.075GHz로 약간씩 하향되었으며, 입력 반사계수는 2.408GHz에서 -39.169dB, 5.075GHz에서 -40.922dB를 나타내었으며, 삽입손실은 2.408GHz에서 -0.437dB, 5.075GHz에서 -1.669dB로 매우 좋은 특성을 얻었다.