In recent years, technology has been developed the way the volume of the portable communication device is reduced but its performance is maintained. The COF(Chip On Film) packaging method is used due to the densification of the lead pitch, especially for the display driver IC. During COF packaging, lead break and film detachment could occur by the high bonding temperature and pressure, and possibility for lead interference can emerge by deformation of leads. In this study, a new double-column arrangement of leads is considered to increase lead density further than the existing zigzag arrangement of leads, and nonlinear structural analysis was carried out to examine whether the interference can occur. The results showed that stress and deformation of the corner region appear relatively higher than those of central region, and interference did not occur by the lead strain for the double-column arrangement of leads with pitch of 25μm. Therefore, double-column lead arrangement can improve lead density by about 176% compared to the zigzag lead arrangement

In this paper, we proposed the optimal process conditions on the electro-gilding process. The responses are plating thickness and Sn proportion. The factors are temperature, current density, and addition. We minimized the total number of experiments based