In recent years, technology has been developed the way the volume of the portable communication device is reduced but its performance is maintained. The COF(Chip On Film) packaging method is used due to the densification of the lead pitch, especially for the display driver IC. During COF packaging, lead break and film detachment could occur by the high bonding temperature and pressure, and possibility for lead interference can emerge by deformation of leads. In this study, a new double-column arrangement of leads is considered to increase lead density further than the existing zigzag arrangement of leads, and nonlinear structural analysis was carried out to examine whether the interference can occur. The results showed that stress and deformation of the corner region appear relatively higher than those of central region, and interference did not occur by the lead strain for the double-column arrangement of leads with pitch of 25μm. Therefore, double-column lead arrangement can improve lead density by about 176% compared to the zigzag lead arrangement

1. 서 론
 2. 수치해석
 3. 결과 및 고찰
  3.1 지그재그 리드패턴 COF 응력 및 변형량
  3.2 이중 리드 배열 COF 응력 및 변형량
 4. 결 론
 후 기
 References

• 황일선(공주대학교 기계공학과 대학원) | Il Sun Hwang
• 박상준(공주대학교 기계공학과 대학원) | Sang Jun Park
• 라재성(Samsung-Toray Electrics Company) | Jay Seong Ra
• 이영림(공주대학교 기계자동차공학부) | Young Lim Lee Corresponding Author