The Ag/WC electrical contacts were prepared via powder metallurgy using 60 wt% Ag, 40 wt% WC, and small amounts of Co3O4 with varying WC particle sizes. After the fabrication of the contact materials, microstructure observations confirmed that WC-1 had an average grain size (AGS) of 0.27 μm, and WC-2 had an AGS of 0.35 μm. The Ag matrix in WC-1 formed fine grains, whereas a significantly larger and continuous growth of the Ag matrix was observed in WC-2. This indicates the different flow behaviors of liquid Ag during the sintering process owing to the different WC sizes. The electrical conductivities of WC-1 and WC-2 were 47.8% and 60.4%, respectively, and had a significant influence on the Ag matrix. In particular, WC-2 exhibited extremely high electrical conductivity owing to its large and continuous Ag-grain matrix. The yield strengths of WC-1 and WC-2 after compression tests were 349.9 MPa and 280.7 MPa, respectively. The high yield strength of WC-1 can be attributed to the Hall–Petch effect, whereas the low yield strength of WC-2 can be explained by the high fraction of high-angle boundaries (HAB) between the WC grains. Furthermore, the relationships between the microstructure, electrical/mechanical properties, and deformation mechanisms were evaluated.

Mechanical fatigue tests which consist of an alternate load and compression cycle show that droppers for 400km/h operation have cyclic mechanical strength of 300N with compression amplitude 0.05m. Numerical simulations for forces on the dropper during the passage of a train tell that dynamic forces can be varied up to 15% due to installation tolerance. Taking into account of the 15% variation, we end up with the maximum allowable peak load of 260N for the dropper. Peak value of measured forces on the dropper at the speed of 400km/h is 152N, which is less than the maximum allowable peak load of 260N. Conclusively, the possibility of fatigue fracture for the dropper is quite low.

The effect of the / phase fraction on the mechanical properties in silicon nitrides was investigated in part 1. In part II, we describe the role of microstructure on the mechanical properties and contact damage of silicon nitrides with coarse/equiaxed and coarse/elongated microstructures. Grain sizes and shapes were controlled by starting powder. Hertzian indentation using spherical indenter was also used to investigate contact damage behavior. Cone cracks from the spherical indentation were suppressed when the silicon nitride contains coarse and elongated grains. Coarse and elongated grains played an important role of cone crack suppression. The size of quasi-plastic zone does not depend on grain size or shape but depends on the fraction of / phase. A quasi-plastic zone was consisting of microcracks by shear stress during indentation.

The effect of / phase on the mechanical properties and contact damage of silicon nitrides ) was investigated. Silicon nitride materials were prepared from two starting powders, at selective increasing hot-pressing temperatures to coarsen the microstructures: (i) from relatively coarse -phase powder, essentially equiaxed - grains, with limited, slow transformation to - grain; (ii) from relatively fine -phase powder, a more rapid transformation to -, with attendant grain elongation. The resulting micro-structure thereby provided a spectrum of / phase ratios, grain sizes, and grain shapes. Fracture strength, hardness, and toughness were measured, and contact damage and strength degradation after indentation were investigated by Hertzian indentation using spherical indenter. A brittle to ductile transition in depended on / phase ratio as well as grain size. Silicon nitride with elongated grains showed a superior, contact damage resistance.