The FOPLP method, which uses a square metal carrier to arrange semiconductor chips, offers significantly superior productivity and efficiency compared to conventional processes. However, metal carriers are prone to warping, dents and scratches due to thermal deformation, making surface inspection and correction work essential. Therefore, this study designed and fabricated a gantry guide capable of mounting an indicator and a vision module to effectively inspect the metal carrier surface and improve quality, then evaluated its performance. In the experiment, the gantry system’s performance was verified by evaluating its repeatability precision, and the vision module ensured data reliability through precision at four different magnifications.