The semiconductor equipment industry is characterized by high technological intensity and a strong demand for customized functionality from client firms. This necessitates the collection and implementation of diverse client requirements, which in turn demands close cross-departmental collaboration and leads to highly complex project structures. To manage this complexity, many semiconductor-related companies operate global matrix organizations based on multiple reporting lines by region, function, and product. These structures entail intricate communication process and pose significant collaboration challenges. This study empirically investigates key factors influencing collaboration and project performance within global matrix organizations in the high-tech semiconductor equipment industry, applying the Technology-Organization-Environment (TOE) framework. The analysis identified significant effects of all examined factors on inter-organizational collaboration performance: three technological sub-factors (usability of communication tools, process standardization, and change management systems), two organizational sub-factors (clarity of roles and responsibilities, and robustness of information-sharing systems), and three environmental sub-factors (alignment of requirements, cultural understanding, and responsiveness to industry standards and regulations). Furthermore, the level of agile implementation was tested as a moderating variable in the relationships between TOE factors and collaboration performance. The results revealed significant moderating effects of agility in specific areas: the usability of communication tools and systematic change management (technological factors); information-sharing structure (organizational factor); and requirement alignment (environmental factor). These findings suggest that agile approaches do not operate as a single-factor solution but interact dynamically with various organizational conditions. By focusing on the underexplored dynamics of global matrix organizations in collaboration performance, this study provides a structured empirical analysis of their operational characteristics. Its theoretical contribution lies in offering an integrative perspective on technological, organizational, and environmental drivers of collaboration and project success, extending current research in high-tech project and organizational performance.

Semiconductor industry is based on equipment industry and timing industry. In particular, semiconductor process is very complex and as semiconductor-chip width tails and is becoming equipment gradually more as a high technology. Equipment operation is primarily engaged in semiconductor manufacturing (engineers and operator) of being conducted by, equipment errors have also been raised. Equipment operational data related to the error of korea occupational safety and health agency were based on data and production engineers involved in the operator's questionnaire was drawn through the error factor. Equipment operating in the error factor of 9 big item and 36 detail item detailed argument based on the errors down, and 9 big item the equipment during operation of the correlation error factor was conducted. Each of the significance level was correlated with the tabulation and analysis. Using the maximum correlation coefficient, the correlation between the error factors to derive the relationship between factors were analyzed. Facility operating with the analysis of error factors (big and detail item) derive a relationship between the model saw. The end of the operation of the facility in operation on the part of the two factors appeared as prevention. Safety aspects and ergonomics aspects of the approach should be guided to the conclusion.