Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

In recent years, technology has been developed the way the volume of the portable communication device is reduced but its performance is maintained. The COF(Chip On Film) packaging method is used due to the densification of the lead pitch, especially for the display driver IC. During COF packaging, lead break and film detachment could occur by the high bonding temperature and pressure, and possibility for lead interference can emerge by deformation of leads. In this study, a new double-column arrangement of leads is considered to increase lead density further than the existing zigzag arrangement of leads, and nonlinear structural analysis was carried out to examine whether the interference can occur. The results showed that stress and deformation of the corner region appear relatively higher than those of central region, and interference did not occur by the lead strain for the double-column arrangement of leads with pitch of 25μm. Therefore, double-column lead arrangement can improve lead density by about 176% compared to the zigzag lead arrangement