The W/O emulsion was formed by mixing hydrophobic nonion surfactants of span 80 and tween 60 with kerosine, and by adding sodium silicate aqueous solution. Precipitating the W/O emulsion by sodium bicarbonate resulted in spherical silica particles. Shape and size distribution of silica particles were observed. The particles were spherical and they have narrow size distribution. Particle sizes were 9.29, 7.39 and 5.73 μm at homogenizer speed of 2500, 3000, and 3500 rpm, respectively. The particle size was decreased by increasing agitation speed due to the formation of emulsion droplet. At fixed agitation speed, absorbed paraffin oil weight were measured and the SiO2/Na2O mole ratio effects on particle size were investigated. Particle size was decreased by increasing the mole ratio of SiO2/Na2O.

The electrical and thermal conductivity of W-Cu composites were investigated as a function of the W-particle size and W-W contiguity. Powder mixtures were prepared by ball milling or mechanical alloying process, and then sintered at various temperatures. The electrical conductivity of sintered composite was increased with decreasing W grain size. Dependence of electrical conductivity on the W grain size was explained by the W-W contiguity concept. The thermal conductivity was increased with increasing the temperature up to but decreased at the temperature above Also, thermal conductivity value was influenced by the W particle size. Change of thermal conductivity in W-Cu composites was discussed based on the observed microstructural characteristics and theoretical considerations.