본 연구는 인쇄회로기판(PCB) 제조 시 에칭공정에서 발생되는 구리이온(Cu+2)을 고농도로 함유한 황산 폐에칭액을 NF 막분리법을 사용하여 에칭액 회수와 구리이온 처리를 효율적으로 수행하기 위한 NF 막여과 공정의 운전 조건을 설정하기 위한 기본 자료를 확보하는데 있다. 이를 위해 미국 Koch사의 SelRO MPS-34 4040 NF 막을 대상으로 구리이온을 고농도(5~25 g/L)로 함유한 모의 황산 폐에칭액의 회분식(dead-end) 나노여과 실험을 수행하여 투과 플럭스와 구리이온의 총괄 배제도를 측정하였다. 이 결과 황산용액에의 막 보관기간이 길수록, 황산용액의 pH가 낮을수록 황산에 의한 NF 막의 손상이 더 크게 발생하여 순수 투과 플러스가 증가하였다. 황산 폐에칭액의 투과 플럭스는 황산용액 내 구리이온의 농도가 증가할수록 막 표면에의 구리이온 농축(농도분극)의 증가에 따라 감소하였으며, 구리이온의 배제도는 구리이온의 농도가 높을수록, pH가 낮을수록, 황산용액 내의 막 보관기간이 길수록 낮아져 초기 37%에서 최소 15% 수준으로까지 감소하였다.

This paper attempted to elucidate pyrolysis reaction characteristics of waste paper laminated phenolic-printed circuit board (p-PCB). Thermogravimetric analysis was performed for the pyrolysis kinetic analysis of waste p-PCB and Pyrolyzer-gas chromatography/mass spectrometry (Py-GC/MS) was also employed to analyze the product distribution of waste p-PCB pyrolysis reaction under isothermal condition (230, 350, 600oC). Kinetic analysis and isothermal Py-GC/MS results showed that the pyrolysis reaction of waste p-PCB has three reaction temperature regions: 1) low temperature decomposition region (< 280oC), 2) medium temperature decomposition region (280 ~ 380oC), 3) high temperature decomposition region (> 380oC). At the first region, triphenyl phosphate used as fire retardant, water, and phenol were vaporized. At the second region, phenolic resin, tetrabromobisphenol-A (TBBA), and laminated paper are decomposed and produce phenols, brominated compounds, and levoglucosan which were the specific pyrolysis reaction products of phenolic resin, TBBA, and laminated paper, respectively. In the final region, cresol and alkyl benzene were detected which can be considered as the decomposition products of phenolic resin. By above results, pyrolysis reaction pathway of waste p-PCB is accounted for a series reaction with four independent reactions of phosphate based frame retardant, TBBA, laminated paper, and phenolic resin.

Through industrial developing, electronic waste is occurred by short lifespan of electronic products. This study discusses an approach of the eco-efficiency for waste PCB (Printed Circuit Board) recycling process through environment and economic analysis. The recycling of waste PCB 1 kg has 1.89E + 00kg CO2 eq. of global warming potential and 2.84E −02 kg antimony eq. of abiotic resource depletion. In terms of economy, this process costs 6,601.91 KRW per 1kg waste PCB recycling. Use of economic and environmental result, when compare with same amounts of virgin metal, environmental-efficiency of GWP (Global Warming Potential) is at 4.16E + 00 and ARD(Abiotic Resource Depletion) is at 2.91E + 00. And compare with secondary metal, environmental-efficiency of GWP is at 2.11E + 00 and ARD is at 8.49E − 01. In addition economic-efficiency is at 1.19E + 00. The results of optimization of this process will be increased. This study will show the process economical and environmental decision making