The automotive industry is moving from the internal combustion engine to electric drive motors. Electricmotors uses a high voltage system requiring the development of resources and components to shield the system. There-fore, in this study, we analyze electromagnetic interference (EMI) shielding effectiveness (SE) characteristics of an autocrash pad according to the ratio of electrically conductive materials and propylene. In order to combine good mechan-ical characteristics and electromagnetic shielding of the automotive crash pad, metal-coated glass fiber (MGF) manufac-turing methods are introduced and compared with powder-type methods. Through this study, among MGF methods, wesuggest that the chopping method is the most effective shielding method.

The conductive polymer composites recently became increasingly to many fields of industry due to their electrical properties. To understand these properties of composites, electrical properties were measured and were studied relatively. Electrical conductivity measurements showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in composites made of a conductive filler and an insulating matrix. It has been showed both experimentally and theoretically that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. This paper was to study epoxy resin filled with copper. The experiment was made with vehicle such as epoxy resin replenished with copper powder and the study about their practical use was performed in order to apply to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 3.065~13.325 in using copper powder. The weight loss of conductive composites happened from 350℃~470℃.

비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.