대마[Cannabis sativa L.]는 오랫동안 섬유작물로 재배되었지만 종실의 기름 함량이 많고 불포 화지방산 비율이 높아 식용유 원료작물로 유망하다. 오랫동안 대마 종실유를 이용해온 유럽의 여러 나라에 서는 압출식으로 착유하는데, 이용 역사가 짧은 우리나라에서는 대마 종실유에 대한 정보 부족으로 소비자 기호도가 낮은 편이다. 본 연구는 압착식과 압출식으로 착유한 대마 종실유의 성분을 분석하여 소비자들에 게 올바른 정보를 제공하기 위해 수행하였다. 압출식 착유기로 착유하면 착유량이 압착식에 비해 많았다. 착유 부산물인 유박은 압출식에서는 으깨어져 얇고 납작하게 배출되지만, 압착식은 종실이 다소 납작해졌 으나 종실의 형상을 유지하였다. 압출식 착유 종실유는 압착식에 비해 Chlorophyll A, B 및 Carotenoid 함 량이 높아 명도(L)는 낮고 녹색과 황색은 진하였다. 지방산 조성에서 Palmitic acid, Stearic acid, Oleic aicid, γ-Linolenic acid 비율은 압출식 착유 종실유가 압착식에 비해 다소 높았으나, Linoleic acid와 α -Linolenic acid는 낮았다. 대마 종실유는 총 토코페롤 함량이 많고 그 중 γ-Tocopherol 함량이 많은 것 이 특징이었는데 압출식 착유 종실유가 압착식에 비해 다소 적었다.

High luminance LED fluorescent light is replaced by halogen light in recent light parts. The housing cover of LED fluorescent light is used many several materials. Though deformity character has less value, polycarbonate cover has cheap, high strength and it is used general purpose. This study is several purposes. 1. No entering foreign matters during continuous extrusion manufacturing process in cutting process, 2. No deformity, exact cutting of pc length and finding method of cutting manufacturing process for polycarbonate cover

Nowadays, we are witnessing all the industrial structures being reorganized on the axis of the carbon dioxide technology to solve the problem of global warming. Therefore, there is need for various approaches even in the construction material industry to realization of the reduction of greenhouse gases and the recycling. Thus, this study sought to apply low energy binder material manufactured with industrial by-products to the extruded panels and develop a composite panel through the modularization of the insulator and the extruded panel. Results are as follows. Regarding the physical properties, the LEC panel had a lower flexural strength with 1.0 N/mm2 than the plain panel, while showing no less absorption rate, percentage of water content, density and compression strength than the plain panel. Panels and insulation attachment was found suitable for B Bond's XPS. It is found that B's glue for XPS is appropriate for putting together the panel and the insulator. As for the thermal transmission coefficient, the LEC panel was lower with 0.384 W/mK than the plain panel but the difference with the composite panel was a mere 0.047 W/mK indicating a similar thermal property to that of the plain composite panel.