We designed new compositions for lead free and low temperature sealing glass frit of ZnO-V2O5-P2O5 system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The ZnO-V2O5-P2O5 system can be used as a sealing material at temperatures even lower than 430˚C. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added TiO2 as a promoter for bonding strength. We examined the effect of TiO2 addition on sealing behaviors of ZnO-V2O5-P2O5 glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of ZnO-V2O5-P2O5 system glasses were improved with TiO2 addition, but showed a maximum value at 5 mol% TiO2 addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.