Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of Cu2SO4 and H2SO4 at a current density of 10 mA/cm2. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about 80 μm. The contact resistance of the copper electrode is 0.89 mΩ·cm2, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are 1 Ω/□ and 40 Ω/□, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.

This study used a packed column reactor and a horizontal flow mesh reactor to examine the removal of copper ions from aqueous solutions using pine bark, a natural adsorbent prepared from Korean red pine (Pinus densiflora). Both equilibrium and nonequilibrium adsorption experiments were conducted on copper ion concentrations of 10mg/L, and the removals of copper ions at equilibrium were close to 95%. Adsorption of copper ions could be well described by both the Langmuir and Freundlich adsorption isotherms. The bark was treated with nitric acid to enhance efficiency of copper removal, and sorption capacity was improved by about 48% at equilibrium; mechanisms such as ion exchange and chelation may have been involved in the sorption process. A pseudo second-order kinetic model described the kinetic behavior of the copper ion adsorption onto the bark. Regeneration with nitric acid resulted in extended use of spent bark in the packed column. The horizontal flow mesh reactor allowed approximately 80% removal efficiency, demonstrating its operational flexibility and the potential for its practical use as a bark filter reactor.

Heavy metals resulted from the increase of human industrial activity are introduced into the environment through rainfall and wastewater, and have harmful effects on inhabitants. In this study, we investigated biological responses such as survival rate, growth rate, emergence rate and sex ratio, and morphological effects of mentum deformity in Chironomus plumosus, an indicator organism to evaluate pollutions on aquatic ecosystem. The survival rate of C. plumosus showed time- and dose-dependent decrease after chromium and copper exposures. Growth rate decreased at 4th day after chromium exposure and significantly reduced at exposure to relatively high concentration (copper 1000 mg L-1) for all exposure times. In addition, we observed that the emergence rate by exposure to copper 1000 mg L-1 was significantly lower than that of the control group. The imbalance of sex ratios showed at relatively low concentrations (chromium 10 and 50 mg L-1) with the high proportion of female and at the relative high concentration (copper 1000 mg L-1) with the high proportion of male. Furthermore, the morphological mentum deformities of C. plumosus observed in the exposed group according to chromium and copper exposure. These results suggest that the heavy metal exposure in environment may influence biosynthetic and morphological stresses of benthic invertebrate C. plumosus, and aquatic midge C. plumosus are potential indicators for toxicity assessment of heavy metals such as chromium and copper.

Recently, copper alloy netting has been proposed as a material for aquaculture facilities that can be set in harsh offshore environments. To design a cage made of copper alloy netting, it is necessary to calculate the flow of water through the netting and force of external sources on the netting. Therefore, this study measured and analyzed the current velocity reduction after passing through the netting and the hydrodynamic forces acting on the netting using copper alloy netting with nine solidity ratios. As a result of the reduction rate of the flow velocity through the netting, the flow reduction rate was increased as the solidity ratio of netting was increased. The flow reduction rate was also increased as the attack angle on the netting was decreased. In analyzing the resistance on the netting, we also discovered that resistance was increased with increase in the flow velocity and solidity ratio. An analysis of the hydrodynamic coefficient acting on the netting is shown that the drag coefficient tends to increase as the attack angle increases. We also analyzed the hydrodynamic coefficient according to the variation of the Reynolds number. When the drag coefficients acting on the netting were analyzed with the different Reynolds numbers, the Reynolds number increased from over 0.3 m/s to a relative constant. Finally, the copper alloy nettings had a smaller velocity reduction rate when comparing the flow velocity reduction rate between copper alloy nettings and nylon nettings.

This study investigates Ag coated Cu2O nanoparticles that are produced with a changing molar ratio of Ag and Cu2O. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and Cu2O determination, and SEM image analysis confirms that Ag is partially coated on the surface of Cu2O nanoparticles. The conductive paste with Ag coated Cu2O nanoparticles approaches the specific resistance of 6.4 Ω·cm for silver paste(SP) as (Ag) /(Cu2O) the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of 100 μm or less has a surface resistance of 5 to 20 μΩ·cm, while in this research an Ag coated Cu2O paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of 10 μm or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

본 연구에서는 하이드라진 기조의 환원성 제염제를 이용한 마그네타이트 산화물의 용해를 다루고 있다. 마그네타이트로부터의 Fe(Ⅱ) 및 Fe(Ⅲ)의 용해는 protonation, surface complexation 및 reduction에 의해 지배를 받는다. 하이드라진과 황산은 산소결합을 파괴하거나 Fe(Ⅲ)이온을 Fe(Ⅱ)이온으로 환원시키기 위한 수소 및 전자를 각각 제공하게 된다. 속도론적 관점에서 보다 효율적인 용해를 위하여 다수의 전이금속의 영향을 분석하여 Cu(Ⅱ) 이온이 효과적임을 확인한 바 있다. Cu(Ⅰ) 이온은 Cu(Ⅱ) 이온으로 산화되는 동안 전자를 방출하여 Fe(Ⅲ) 이온을 환원시키고 다시 하이드라진에 의해 Cu(Ⅰ) 이온으로 환원되게 된다. 본 연구를 통해 제염용액에 매우 적은 양의 구리 이온 (약 0.5 mM)을 첨가함에 따라 평균 40% 용해속도가 향상됨을 확인하였고, 특히 특정 조건에서는 70% 이상 용해속도가 향상 됨을 확인하였다. 구리 이온이 하이드라 진과 배위결합을 이루는 지에 대해서는 아직 명확하지 않으나, 분명한 것은 Cu(Ⅱ)/H+/ N2H4으로 이루어진 제염제는 효과적인 용해성능을 가지고 있다는 것이다.

In the present study, we develop a conductive copper/carbon nanomaterial additive and investigate the effects of the morphologies of the carbon nanomaterials on the conductivities of composites containing the additive. The conductive additive is prepared by mechanically milling copper powder with carbon nanomaterials, namely, multi-walled carbon nanotubes (MWCNTs) and/or few-layer graphene (FLG). During the milling process, the carbon nanomaterials are partially embedded in the surfaces of the copper powder, such that electrically conductive pathways are formed when the powder is used in an epoxy-based composite. The conductivities of the composites increase with the volume of the carbon nanomaterial. For a constant volume of carbon nanomaterial, the FLG is observed to provide more conducting pathways than the MWCNTs, although the optimum conductivity is obtained when a mixture of FLG and MWCNTs is used.

Copper oxide thin films are deposited using an ultrasonic-assisted spray pyrolysis deposition (SPD) system. To investigate the effect of substrate temperature and incorporation of a chelating agent on the growth of copper oxide thin films, the structural and optical properites of the copper oxide thin films are analyzed by X-ray diffraction (XRD), field-emssion scanning electron microscopy (FE-SEM), and UV-Vis spectrophotometry. At a temperature of less than 350 ℃, threedimensional structures consisting of cube-shaped Cu2O are formed, while spherical small particles of the CuO phase are formed at a temperature higher than 400 ℃ due to a Volmer-Weber growth mode on the silicon substrate. As a chelating agent was added to the source solutions, two-dimensional Cu2O thin films are preferentially deposited at a temperature less than 300 ℃, and the CuO thin film is formed even at a temperature less than 350 ℃. Therefore the structure and crystalline phase of the copper oxide is shown to be controllable.

A conductive additive is prepared by dispersing multi-walled carbon nanotubes (MWCNTs) on Cu powder by mechanical milling and is distributed in epoxy to enhance its electrical conductivity. During milling, the MWCNTs are dispersed and partially embedded on the surface of the Cu powder to provide electrically conductive pathways within the epoxy-based composite. The degree of dispersion of the MWCNTs is controlled by varying the milling medium and the milling time. The MWCNTs are found to be more homogeneously dispersed when solvents (particularly, non-polar solvent, i.e., NMP) are used. MWCNTs gradually disperse on the surface of Cu powder because of the plastic deformation of the ductile Cu powder. However, long-time milling is found to destroy the molecular structure of MWCNTs, instead of effectively dispersing the MWCNTs more uniformly. Thus, the epoxy composite film fabricated in this study exhibits a higher electrical conductivity than 1.1 S/cm.

Crystal structure of the L12 type (Al,X)3Ti alloy (X = Cr,Cu) is analyzed by X-ray diffractometry and the nonuniform strain behavior at high temperature is investigated. The lattice constants for the L12 type (Al,X)3Ti alloys decrease in the order of the atomic number of the substituted atom X, and the hardness tends to increase. In a compressive test at around 473K for Al67.5Ti25Cr7.5, Al65Ti25Cr10 and Al62.5Ti25Cu12.5 alloys, it is found that the stress-strain curves showed serration, and deformation rate dependence appeared. It is assumed that the generation of serration is due to dynamic strain aging caused by the diffusion of solute atoms. As a result, activation energy of 60-95 kJ/mol is obtained. This process does not require direct involvement. In order to investigate the generation of serrations in detail, compression tests are carried out under various conditions. As a result, in the strain rate range of this experiment, serration is found to occur after 470K at a certain critical strain. The critical strain increases as the strain rate increases at constant temperature, and the critical strain tends to decrease as temperature rises under constant strain rate. This tendency is common to all alloys produced. In the case of this alloy system, the serration at around 473K corresponds to the case in which the dislocation velocity is faster than the diffusion rate of interstitial solute atoms at low temperature.

Cu-Fe alloys (CFAs) are much anticipated for use in electrical contacts, magnetic recorders, and sensors. The low cost of Fe has inspired the investigation of these alloys as possible replacements for high-cost Cu-Nb and Cu-Ag alloys. Here, alloys of Cu and Fe having compositions of Cu100-xFex (x = 10, 30, and 50 wt.%) are prepared by gas atomization and characterized microstructurally and structurally based on composition and powder size with scanning electron microscopy (SEM) and X-ray diffraction (XRD). Grain sizes and Fe-rich particle sizes are measured and relationships among composition, powder size, and grain size are established. Same-sized powders of different compositions yield different microstructures, as do differently sized powders of equal composition. No atomic-level alloying is observed in the CFAs under the experimental conditions.

When the heat flux on the heating surface following changing heat condition in the boiling heat transfer system exceeds critical heat flux, the critical heat flux phenomenon is going over to immediately the film boiling area and then it is occurred the physical destruction phenomenon of various heat transfer systems. In order to maximize the safe operation and performance of the heat transfer system, it is essential to improve the CHF(Critical Heat Flux) of the system. Therefore, we have analysis the effect of improving CHF and characteristics of heat transfer following the nanoparticle coating thickness. As the results, copper nanocoating time are increased to CHF, and in case of nano-coatings are increased spray-deposited coating times more than in the fure water; copper nanopowder is increased up to 6.40%. The boiling heat transfer coefficients of the pure water are increased up to 5.79% respectively. Also, the contact angle is decreased and surface roughness is increased when nano-coating time is increasingly going up.

In an aquatic environment, toxicity of metals to organisms depends on external factors (type of metal, exposure concentration and duration, environmental parameters, and water quality) and intracellular processes (metal-binding sites and detoxification). Toxicity of copper (Cu) on the marine microalga Tetraselmis suecica was investigated in this study. Dose-dependent (Cu concentration dependent) inhibition of growth and cell division, as well as, variation of intra- and extra-cellular Cu, Fe and Zn content was observed. T. suecica was sensitive to Cu; the 96 h EC50 (concentration to inhibit growth-rate by 50%) of growth rate (μ) (21.73 μM L-1), cell division day-1 (18.39 μM L-1), and cells mL-1 (13.25 μM L-1) demonstrate the toxicity of Cu on this microalga. High intra- (19.86 Pg cell-1) and extra-cellular (54.73 Pg cell-1) Cu concentrations were recorded, on exposure to 24.3 and 72.9 μM L-1 of Cu.

We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of asdeposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37%, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.