A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

For the fabrication of core-shell structure bimetallic lead-free solder balls, both the critical temperature (Tcr) for the phase separation of two immiscible liquid phases and the temperature coefficient of the interfacial tension between the two separated liquid phases are required. In order to obtain this information, the temperature dependence of the surface tension of 60%Bi-24%Cu-16%Sn(-REM) alloys was measured using the constrained drop method. The slope of the temperature dependence of the surface tension changed clearly at a critical temperature for the separation of two immiscible liquid phases. The critical temperature of the 60%Bi-24%Cu-16%Sn alloy was estimated to be 1097K. An addition of 0.05% Ce decreased the critical temperature to 1085K, whereas that of 0.05% La increased it to 1117K. It was found that the surface tension and its temperature coefficient of the 60%Bi-24%Cu-16%Sn alloy were slightly increased by the addition of 0.05% Ce and 0.05% La. In addition, additions of Ce and La increased the temperature coefficient of the interfacial tension.

This study is focused on the antimicrobial activity of cyanobacteria Microcystis aeruginosa by the reduction and oxidation reaction of copper and zinc alloy metal fiber filter. Cu/Zn ion is easily makes radicals with molecular hydroperoxide. Especially, hydroperoxide radical shows strong toxicity to the strains. Plasma membrane causes conformational change when hydroperoxide radical binds to plasma membrane. Elution of copper ion from copper and zinc alloy metal fiber is detected in the cyanobacteria solution as 0.5 ppm, and that of zinc ion is 0 ppm respectively. Zinc ion is figured to form a hydroxide in the cyanobacteria solution and precipitated to form a sludge. The concentration of chlorophyll-a in the cyanobacteria solution was proved to be the index of antimicrobial level of Microcystis aeruginosa.

Al-Cu alloy nano powders have been produced by the electrical explosion of Cu-plated Al wire. The porous nano particles were prepared by leaching for Al-Cu alloy nano powders in 40wt% NaOH aqueous solution. The surface area of leached powder for 5 hours was 4 times larger than that of original alloy nano powder. It is demonstrated that porous nano particles could be obtained by selective leaching of alloy nano powder. It is expected that porous Cu nano powders can be applied for catalyst of SRM (steam reforming methanol).

Cu-Ni-P alloy nano powders were fabricated by the electrical explosion of electroless Ni plated Cu wires. The effect of applied voltage on the explosion was examined by applying pulse voltage of 6 and 28 kV, The estimated overheating factor, K, were 1.3 for 6 kV and 2.2 for 28 kV. The powders produced with pulse voltage of 6 kV were composed of Cu-rich solid solution, Ni-rich solid solution, and phase. While, those produced with 28 kV were complete Cu-Ni-P solid solution and small amount of phase. The initial P content of 6.5 at.% was reduced to 2-3 at.% during explosion due to its high vapour pressure.

Cu-Zn alloy nano powders were fabricated by the electrical explosion of Zn-electroplated Cu wire along with commercial brass wire. The powders exploded from brass wire were composed mainly of phases while those from electroplated wires contained additional Zn-rich phases as , and Zn. In case of Zn-elec-troplated Cu wire, the mixing time of the two components during explosion might not be long enough to solidify as the phases of lower Zn content. This along with the high vapor pressure of Zn appears to be the reason for the observed shift of explosion products towards the high-Zn phases in electroplated wire system.

Two atomized alloy powders were pre-compacted by cold and subsequently hot forged at temperatures ranging from 653K to 845K. The addition of Cu and Mg causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addition to Al-Fe based intermetallics, Al2Cu and Al2CuMg intermetallics appeared. The volume fraction of intermetallic dispersoids increased by the addition of Cu and Mg. Compressive strength of the present alloys was closely related to the volume fraction of intermetallic dispersoids.

An infiltration technique using W-Cu composite powder has been developed to enhance microstructural uniformity of W-Cu pseudo-alloy. W-Cu composite powder, manufactured by reduction from WO3 and CuO powder mixtures, were blended with W powder and then cold iso-statically pressed into a cylindrical bar under 150 MPa. The pressed samples were pre-sintered at 1300 oC for 1 hour under hydrogen to make a skeleton structure. This skeleton structure was more homogeneous than that formed by using W and Cu powder mixtures. The skeleton structures were infiltrated with Cu under hydrogen atmosphere. The infiltrated W-Cu pseudo-alloy showed homogeneous microstructure without Cu rich region.

A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.

Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and were the major phases. As the Cu layer becomes thicker, Al diminished while phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

The corrosion performance of a powder metallurgical aluminum alloy in aeronautical environments was studied for both as sintered and heat treated states. Sintered samples were obtained by uniaxial pressing of an Al-Cu-Mg prealloyed powder followed by liquid phase sintering. The heat treatments applied were T4 and T6. Corrosion behaviour was assessed by means of potentiodynamic polarization. Results for the equivalent commercial wrought counterpart, AA2024-T3, are also presented for comparison. Similar corrosion performance was observed for both as sintered and AA2024-T3 samples, while corrosion resistance of the PM materials was improved by the heat treatment, especially in the T4 state.

In the present work, the sintering behavior of high strength Al-5.6Zn-2.5Mg-1.6Cu (in wt.%) alloy compacts prepared from elemental powders was investigated. Microstructural evaluation was accompanied by XRD and DSC methods in order to determine the temperature and chemical composition of the liquid phases formed during sintering. It was found that three transient liquid phases are formed at 420, 439 and 450 . Microstructural study revealed the progressive formation of sintered contacts due to the presence of the liquid phases, although the green compact expands as a result of the melt penetration along the grain boundaries. While Zn melts at , the intermetallic phases formed between Al and Mg were found to be responsible for the formation of liquid phase and the dimensional change at higher temperatures.

The dispersion strengthened copper alloy was attracted as thermal and electrical functional material for the high mechanical strength, high thermal stability and good conductivity of . In the present study, the focus is on the synthesis of dispersed copper alloy by spark plasma sintering process using copper oxide and titanium diboride as raw materials. The mechanical, thermal and electrical properties of sintered bodies were discussed with the sintering parameters, and developed microstructure and phase of sintered bodies.

The present work illustrates the use of water-soluble cupric salts as ingredients of binder for injection molding of Cu. Parts produced are dense, homogeneous and have good surface finish, compared to those produced using conventional binder system. This new binder system provides also process-simplification benefit. with the purity of was selected for this study. Rapid sintering process involving thermal decomposing was successful in densification for 1h. Final density that is about of theoretical value could be obtained, and are distinguishable from conventionally processed W-Cu composites.

The alumina dispersion-strengthened (DS) C15715 Cu alloy fabricated by a powder metallurgy route was annealed at temperatures ranging from in the air and in vacuum. The effect of the annealing on microstructural stability and room-temperature mechanical properties of the alloy was investigated. The microstructure of the cold rolled OS alloy remained stable until the annealing at in the air and in vacuum. No recrystallization of original grains occurred, but the dislocation density decreased and newly formed subgrains were observed. The alloy annealed at in the air experienced recrystallization and grain growth took place, however annealing in vacuum at did not cause the microstructural change. The mechanical property of the alloy was changed slightly with the annealing if the microstructure remained stable. However, the strength of the specimen that was recrystallized decreased drastically.