Synthesis of novolac resins by condensation of phenolic compounds with formaldehyde
Novolac is widely used as the primary solid component of most photoresists in semiconductor and microelectronic devices. In this study, novolac resins were prepared by condensation of 35% formaldehyde with phenolic compounds such as m-/p-cresol, 2,5-dimethylphenol and bisphenol A in the presence of oxalic acid as catalyst. The average molecular weight (Mw) of these novolac resins has been varied on the changing of mixing ratio of m-/p-cresol/2,5-dimethylphenol/bisphenol A or formaldehyde/phenolic compound. Also, thermal properties of novolac were observed by TGA.