Chemical incorporation of epoxy-modified graphitic layers in epoxy/novolac phenolic resin matrices was carried out through co-curing of epoxy and novolac resins using triphenylphosphine as catalyst. First, (3-glycidyloxypropyl) trimethoxysilane (GPTMS) was grafted on graphene oxide (GO) surface to obtain epoxidized GO layers. Then epoxy resin and GPTMS-modified GO were incorporated into thermosetting reaction using novolac resin in the presence of triphenylphosphine. Covalent attachment of GPTMS-modified GO to the resin matrices resulted in a hybrid composite with high thermal characteristics. Fourier-transform infrared spectroscopy, X-ray photoelectron spectroscopy, thermogravimetric analysis (TGA), X-ray diffraction, and Raman spectroscopy were used for approving modification of GO with GPTMS. The images resulted from scanning and transmission electron microscopies exhibited GO layers with lots of creases turning to smooth layers with a few thin ripples after modification with GPTMS. TGA results showed that thermal characteristics of resins were improved by the addition of GPTMS-modified GO. Char residue of the hybrid composites containing 0.5 and 1 wt% of GPTMS-modified GO reached 28.1 and 34.3%, respectively. Also, their maximum thermal degradation temperature was also increased by the incorporation of GPTMS-modified GO.

약용매에 용해가 가능한 알킬기 변성 에폭시수지를 합성하기 위하여, 1단계에서 당량비 기준 dodecyl phenol (DP)/formaldehyde = 1.25~1.333/1.0로 하여, 합성된 도데실 페놀 노볼락 화합물의 벤젠 고리수가 3.0~5.0가 되도록 합성하였고, 2단계에서는 당량비 기준으로 1단계에서 합성된 도데실 페놀 노 볼락 화합물/비스페놀A형 에폭시수지 (YD-128) = 1/2로 합성하였고, 3단계는 지방산을 투입하여 지방산 변성 도데실 페놀 노볼락 에폭시수지를 합성하였다. 합성된 수지의 반응성도, 점성도와 분자량 변화, 약용 매 가용성 등을 측정한 결과, 1단계에서 합성된 도데실 페놀 노볼락 화합물의 벤젠고리수가 늘어남에 따라 지방산 변성 도데실 페놀 노볼락 에폭시수지의 점도가 상승하였고, 약용매 가용성이 우수하였다. 도료 제 조 후 물성을 측정한 결과, 개환촉매로 triphenylphosphine(TPP)을 사용한 DPFAC-5는 건조속도, 접착성, 도막경도, 내충격성, 내산성 및 저장안정성이 양호하였다.

A hierarchical pore structured novolac-type phenol based-activated carbon with micropores and mesopores was fabricated. Physical activation using a sacrificialsilicon dioxide (SiO2) template and chemical activation using potassium hydroxide (KOH) were employed to pre-pare these materials. The morphology of the well-developed pore structure was character-ized using field-emissionscanning electron microscopy. The novolac-type phenol-based activated carbon retained hierarchical pores (micropores and mesopores); it exhibited high Brunauer-Emmett-Teller specificsurface areas and hierarchical pore size distributions. The hierarchical pore novolac-type phenol-based activated carbon was used as an electrode in electric double-layer capacitors, and the specificcapacitance and the retained capacitance ratio were measured. The specificcapacitances and the retained capacitance ratio were en-hanced, depending on the SiO2 concentration in the material. This result is attributed to the hierarchical pore structure of the novolac-type phenol-based activated carbon.

The effects of fillers on the mechanical and thermal properties of glass/novolac composites have been studied. The matrix polymer and reinforcement were novolac type phenolic resin and milled glass fiber, respectively. Three different fillers, such as calcium carbonate, aluminum oxide, and wood powder were used for glass fiber reinforced plastic(GFRP) manufacture. Gravity, moisture content, tensile and flexural strength were measured to analyze the mechanical properties of GFRP and the final composites was burned in the electronic furnace at 1000℃ to confirm thermal properties GFRP containing aluminium oxide shows the highest thermal stability with 32% of weight loss at 1000℃ for one hour. GFRP containing calcium carbonate shows the maximum flexural strength (146 MPa), but that containing wood powder dose the highest tensile strength (65 MPa). Conclusively, we found that the characteristics of final composites strongly depend on several factors, such as types of materials, contents and chemical affinity of fillers. Therefore, it is very important to set up the combination of fillers for GFRP manufacturing to improve both mechanical and thermal properties at the same time.

Novolac is widely used as the primary solid component of most photoresists in semiconductor and microelectronic devices. In this study, novolac resins were prepared by condensation of 35% formaldehyde with phenolic compounds such as m-/p-cresol, 2,5-dimethylphenol and bisphenol A in the presence of oxalic acid as catalyst. The average molecular weight (Mw) of these novolac resins has been varied on the changing of mixing ratio of m-/p-cresol/2,5-dimethylphenol/bisphenol A or formaldehyde/phenolic compound. Also, thermal properties of novolac were observed by TGA.