The study will design the structural optimization of 30W LED heat sink using the thermal conductive plastic materials. The advantages of thermal conductive plastic heat sink are having formability and being able to lighten products. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 22 fins, which are 1.5mm thick and a 3.8mm-thick base. The weight of the heat sink was 310g, and the highest and the lowest temperature were 64.93℃ and 45.96℃ respectively. Because of the low thermal conductivity of the thermal conductive plastic, the highest and the lowest temperature of the thermal conductive plastic heat sink were 14.3℃ higher and 2.19℃ lower respectively than an aluminum heat sink

1. 서 론
 2. 실험 방법
  2.1 열전도 플라스틱 소재
  2.2 방열판 설계
  2.3 시뮬레이션 조건
 3. 실험 결과
  3.1 방열판 시뮬레이션 온도분포도
  3.2 제작된 30W급 방열판 방열성능 평가
 4. 결 론
 후 기
 References

• 최원호(원광대학교 정보통신학과) | Won-Ho Choi
• 최두호(원광대학교 정보통신학과) | Doo-Ho Choi
• 박대희(원광대학교 정보통신학과) | Dae-Hee Park Corresponding Author