Reducing underwater radiated noise from a ship is a critical issue for ensuring the survivability of the vessel. As high-speed signal processing and interlocking algorithms become more sophisticated, the heat intensity of shipboard equipment is increasing per unit volume. When designing shipboard equipment, it is necessary to consider the trade-off between heat dissipation and noise reduction. Following an analysis of the trade-offs, it was determined that the arrangement of Fan Ass'y A and B exhibited excellent noise and heat dissipation characteristics. Based on this, PWM control operating zones were derived. It was determined that the placement of Fan Ass'y A and B in the operating zone would increase the PWM duty cycle from 33% to 58% using a signal frequency of 25kHz band with guaranteed reliability. This would increase the noise by approximately 9dB(A) but reduce the internal board reference temperature by up to 15℃.

The purpose of this study is to provide basic data for setting environmental design standards for domestic greenhouses. We conducted experiments on thermal environment measurement at two commercial greenhouses where hot water heating system is adopted. We analyzed heat transfer characteristics of hot water heating pipes and heat emission per unit length of heating pipes was presented. The average air temperature in two greenhouses was controlled to 16.3oC and 14.6oC during the experiment, respectively. The average water temperature in heating pipes was 52.3oC and 45.0oC, respectively. Experimental results showed that natural convection heat transfer coefficient of heating pipe surface was in the range of 5.71~7.49W/m2 oC. When the flow rate in heating pipe was 0.5m/s or more, temperature difference between hot water and pipe surface was not large. Based on this, overall heat transfer coefficient of heating pipe was derived as form of laminar natural convection heat transfer coefficient in the horizontal cylinder. By modifying the equation of overall heat transfer coefficient, a formula for calculating the heat emission per unit length of hot water heating pipe was developed, which uses pipe size and temperature difference between hot water and indoor air as input variables. The results of this study were compared with domestic and foreign data, and it was found to be closest to JGHA data. The data of NAAS, BALLS and ASHRAE were judged to be too large. Therefore, in order to set up environmental design standards for domestic greenhouses, it is necessary to fully examine those data through further experiments.

본 연구에서는 DVR 내부 공기유동을 직접 제어하여 CPU의 온도를 낮추기 위한 유동제어 구조물을 제안하였다. 제안된 구조물은 세 개의 얇은 판의 형태로 구성되었으며, DVR 내부의 공기 유동을 포괄적으로 제어하여 CPU의 효율적인 방열을 유도하고자 하였다. DOE와 RSM을 이용한 매개변수 연구기법을 통해 유동제어 구조물의 형상을 최적화하였으며, 해석에는 유한체적방법을 이용한 유체역학 분석 패키지인 FlowVision을 사용하였다. 실제 DVR 기기에서의 실험을 통해 해석 결과를 검증한 결과 CPU의 온도가 16.1℃ 낮아짐을 확인하였다

The study will design the structural optimization of 30W LED heat sink using the thermal conductive plastic materials. The advantages of thermal conductive plastic heat sink are having formability and being able to lighten products. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 22 fins, which are 1.5mm thick and a 3.8mm-thick base. The weight of the heat sink was 310g, and the highest and the lowest temperature were 64.93℃ and 45.96℃ respectively. Because of the low thermal conductivity of the thermal conductive plastic, the highest and the lowest temperature of the thermal conductive plastic heat sink were 14.3℃ higher and 2.19℃ lower respectively than an aluminum heat sink

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.