Cu circuits were successfully fabricated on flexible PET(polyethylene terephthalate) substrates using wettability difference and electroless plating without an etching process. The wettability of Cu plating solution on PET was controlled by oxygen plasma treatment and SiOx-DLC(silicon oxide containing diamond like carbon) coating by HMDSO(hexamethyldisiloxane) plasma. With an increase of the height of the nanostructures on the PET surface with the oxygen plasma treatment time, the wettability difference between the hydrophilicity and hydrophobicity increased, which allowed the etchless formation of a Cu pattern with high peel strength by selective Cu plating. When the height of the nanostructure was more than 1400 nm (60 min oxygen plasma treatment), the reduction of the critical impalement pressure with the decreasing density of the nanostructure caused the precipitation of copper in the hydrophobic region.

1. 서론
2. 실험방법
3. 결과 및 고찰
4. 결론
Acknowledgement
References

• 박상진(충남대학교 신소재공학과) | Sang-Jin Park
• 고태준(한국과학기술연구원 계산과학연구센터) | Tae-Jun Ko
• 윤주일(한성대학교 기계시스템 공학과) | Juil Yoon
• 문명운(한국과학기술연구원 계산과학연구센터) | Myoung-Woon Moon
• 한준현(충남대학교 신소재공학과) | Jun Hyun Han Corresponding Author