Multi-walled carbon nanotube (MWCNT)–copper (Cu) composites are successfully fabricated by a combination of a binder-free wet mixing and spark plasma sintering (SPS) process. The SPS is performed under various conditions to investigate optimized processing conditions for minimizing the structural defects of CNTs and densifying the MWCNT–Cu composites. The electrical conductivities of MWCNT–Cu composites are slightly increased for compositions containing up to 1 vol.% CNT and remain above the value for sintered Cu up to 2 vol.% CNT. Uniformly dispersed CNTs in the Cu matrix with clean interfaces between the treated MWCNT and Cu leading to effective electrical transfer from the treated MWCNT to the Cu is believed to be the origin of the improved electrical conductivity of the treated MWCNT–Cu composites. The results indicate the possibility of exploiting CNTs as a contributing reinforcement phase for improving the electrical conductivity and mechanical properties in the Cu matrix composites.

Abstract
 1. 서 론
 2. 실험 방법
 3. 결과 및 고찰
 4. 결 론
 References

• 조승찬(재료연구소 복합재료연구본부) | Seungchan Cho Corresponding Author
• 조일국(재료연구소 복합재료연구본부) | Ilguk Jo
• 이상복(재료연구소 복합재료연구본부) | Sang-Bok Lee
• 이상관(재료연구소 복합재료연구본부) | Sang-Kwan Lee
• 최문희(삼성전기) | Moonhee Choi
• 박재홍(차세대소재연구소) | Jehong Park
• 권한상(차세대소재연구소, 부경대학교 신소재시스템공학과) | Hansang Kwon
• 김양도(부산대학교 재료공학부) | Yangdo Kim