The ACF(Anisotropic Conductive Film) is used for bonding Drive IC and OLED display device panel. If ACF bonding process is problem, a malfunction of line defect can occur. Because electric resistance increase between the panel and drive IC after a period of time, drive IC can not supply enough current to the panel. This paper is studied on a method of test for line defect.

Abstract
 1. 서론
  1.1 연구의 목적
  1.2 연구방법 및 범위
 2. 이론적 배경
  2.1 COG용 ACF
  2.2 OLED Display Device의 고장
  2.3 COG 본딩의 고장 모드/메카니즘
  2.4 고장 스트레스
 3. 실험방법
 4. 실험 결과 및 검증
 5. 결론
 6. 참고문헌

• 최영태 | Young-Tae Choi
• 조재립 | Jai-Rip Cho