In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu3P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/cm2. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.

Abstract
1. 서 론
2. 실험 방법
3. 결과 및 고찰
4. 결 론
References

• 윤성준(인하대학교 신소재공학과) | Seong-June Youn (Department of Materials Science and Engineering, Inha University)
• 김영균(인하대학교 신소재공학과) | Young-Kyun Kim (Department of Materials Science and Engineering, Inha University)
• 박재성(LT 메탈㈜) | Jae-Sung Park (LT Metal LTD.)
• 박주현(LT 메탈㈜) | Joo-Hyun Park (LT Metal LTD.)
• 이기안(인하대학교 신소재공학과) | Kee-Ahn Lee (Department of Materials Science and Engineering, Inha University) Corresponding Author