논문 상세보기

고전류밀도 구리전해도금에서 첨가제의 주요효과 KCI 등재 SCOPUS

Main Effects of Additives on Copper Electroplating at High Current Density

  • 언어KOR
  • URLhttps://db.koreascholar.com/Article/Detail/443733
구독 기관 인증 시 무료 이용이 가능합니다. 4,000원
한국재료학회지 (Korean Journal of Materials Research)
한국재료학회 (Materials Research Society Of Korea)
초록

This study investigates the changes in the surface characteristic, electrical and mechanical properties of copper foils electrodeposited in electrolytes with added various additives (Janus Green B (JGB), 3–mercapto–1–propane sulfonic acid (MPSA), Polyethylene glycol (PEG) and Chloride ion) under high current density. The main effect of additives on these properties was analyzed. In the group with added JGB, the crystal size on the surface became finer, and a homogeneous surface was observed. However, dented areas were observed, which decreased with an increase in chloride ions. When 100 ppm of PEG and 10 ppm of JGB were added, the fine dents on the surface increased. When a certain amount or more of additives were added, defects on the surface occurred due to competition between additives. The addition of JGB induced crystal growth in the direction of the (111) plane. Copper foils with excellent yield strength, tensile strength, and elongation could be obtained with an appropriate crystal size. The addition of JGB mainly affected crystal size and the direction of crystal growth, which is an important factor for controlling mechanical properties. PEG mainly affected elongation, and chloride ions had a primary effect on surface roughness, resistivity, and corrosion rate. Therefore, controlling additives is an effective way to significantly affect the manufacture of copper foil and produce various suitable properties in high demand.

목차
Abstract
1. 서 론
2. 실험 방법
3. 결과 및 고찰
4. 결 론
References
<저자소개>
저자
  • 우태규(전북대학교 유연인쇄전자전문대학원 및 전북대학교 로스알라모스연구소-전북대학교 한국공학연구소) | Tae-Gyu Woo (Graduate School of Flexible and Printable Electronics and LANL-CBNU Engineering Institute Korea, Jeonbuk National University, Jeonju 54896, Republic of Korea)
  • 박일송(전북대학교 신소재공학부 및 신소재개발연구센터) | Il-Song Park (Division of Advanced Materials Engineering, Research Center for Advanced Materials Development, Jeonbuk National University, Jeonju 54896, Republic of Korea) Corresponding author