This study investigates the changes in the surface characteristic, electrical and mechanical properties of copper foils electrodeposited in electrolytes with added various additives (Janus Green B (JGB), 3–mercapto–1–propane sulfonic acid (MPSA), Polyethylene glycol (PEG) and Chloride ion) under high current density. The main effect of additives on these properties was analyzed. In the group with added JGB, the crystal size on the surface became finer, and a homogeneous surface was observed. However, dented areas were observed, which decreased with an increase in chloride ions. When 100 ppm of PEG and 10 ppm of JGB were added, the fine dents on the surface increased. When a certain amount or more of additives were added, defects on the surface occurred due to competition between additives. The addition of JGB induced crystal growth in the direction of the (111) plane. Copper foils with excellent yield strength, tensile strength, and elongation could be obtained with an appropriate crystal size. The addition of JGB mainly affected crystal size and the direction of crystal growth, which is an important factor for controlling mechanical properties. PEG mainly affected elongation, and chloride ions had a primary effect on surface roughness, resistivity, and corrosion rate. Therefore, controlling additives is an effective way to significantly affect the manufacture of copper foil and produce various suitable properties in high demand.

The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C56H68Cl4CuN16S4). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 μm. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/cm2. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/cm2. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/cm2 considering the productivity and mechanical properties of copper foil.