Philological Studies of Epitaph in Sui Dynasty (《隋代墓誌銘彙考》) is the latest achievement of the current literature research of the Sui Dynasty epitaph, which is very importan for the study of politics, history, culture and language etc. But the book also has some little mistakes, especially on the words and punctuation of sentences. Basing on checking the original rubbings, this paper revised 20 cases from the perspective of evolution rules of Chinese characters, the words matching, Context meaning and Chinese characters rhyme etc.

There are many allographs in Sui Tang and 5-Dynasty periods Carved stone Regular script character.This paper is a corpus-based study which chooses and analyzes 9874 allographs extracted from the corpus of Sui Tang and 5-Dynasty periods Carved stone Regular script character for the exploration of its general features.It indicates that, the primary reason of character variation is the variation of the component; the second reason is the variation of the stroke; a distinguishing feature of the allograph is generalizability.

In this study, by using oleic acid and polypropylene glycol, good natured antifoaming agent for suitable electronics process under the alkaline conditions were synthesized. For the synthesized mono and diesters, acid value, hydroxyl value was measured, and identified by FT-IR and 1H-NMR spectroscopy. Surface properties such as surface tension, critical micelle concentration(cmc) for diluted aqueous solution was measured, and tested the antifoaming properties according to the difference of alkyl chain length, various concentration, temperature and pH. The surface tension of synthesized antifoaming agent, PPMO(Polypropylene glycol monooleate) was 24.3 dyne/cm, PPDO(Polypropylene glycol dioleate) was 23.7 dyne/cm. By increasing of the alkyl chain length, surface tension was decreased slightly, and showed good antifoaming properties at 0.06 wt% concentration and 50℃, pH 11. These synthesized compounds are expected to apply as a suitable antifoaming agents in the semiconductor and the PCB(Printed Circuit Board) manufacturing process.