A roll-bonding process was applied to fabricate an AA1050/AZ91/AA1050 laminate complex sheet. Two AA1050 and one AZ91 magnesium sheets of 2 mm thickness, 30 mm width and 200 mm length were stacked up after surface treatment that included degreasing and wire brushing; material was then reduced to a thickness of 3 mm by one-pass cold rolling. The laminate sheet bonded by the rolling was further reduced to 2 mm in thickness by conventional rolling. The rolling was performed at 623K without lubricant using a 2-high mill with a roll diameter of 210 mm. The rolling speed was 15.9 m/min. The AA1050/AZ91/AA1050 laminate complex sheet fabricated by roll bonding was then annealed at 373~573K for 0.5h. The microstructure of the complex sheets was revealed by electron back scatter diffraction (EBSD) measurement; the mechanical properties were investigated by tensile testing and hardness testing. The strength of the complex sheet was found to increase by 11 % and the tensile elongation decreased by 7%, compared to those values of the starting material. In addition, the hardness of the AZ91 Mg region was slightly higher than those of the AA1050 regions. Both AA1050 and AZ91 showed a typical deformation structure in which the grains were elongated in the

Microstructural evolution in the thickness direction of an oxygen free copper processed by accumulative rollbonding (ARB) is investigated by electron back scatter diffraction (EBSD) measurement. For the ARB, two copper alloy sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked and roll-bonded by about 50% reduction rolling without lubrication at an ambient temperature. The bonded sheet is then cut to the two pieces of the same dimensions and the same procedure was repeated on the sheets up to eight cycles. The specimen after 1 cycle showed inhomogeneous microstructure in the thickness direction so that the grains near the surface were finer than those near the center. This inhomogeneity decreased with an increasing number of ARB cycles, and the grain sizes of the specimens after 3 cycles were almost identical. In addition, the aspect ratio of the grains decreased with an increasing number of ARB cycles due to the subdivision of the grains by shear deformation. The fraction of grains with high angle grain boundaries also increased with continuing process of the ARB so that it was higher than that of the low angle grain boundaries in specimens after 3 cycles. A discontinuous dynamic recrystallization occurred partially in specimens after 5 cycles.

A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.