Tungsten carbide (WC) hard materials are used in various industries and possess a superior hardness compared to other hard materials. They have particularly high melting points, high strength, and abrasion resistance. Accordingly, tungsten carbide hard materials are used for wear-resistant tools, cutting tools, machining tools, and other tooling materials. In this study, the WC-5wt.%Co, Fe, Ni hard materials are densified using the horizontal ball milled WC-Co, WC-Fe, and WC-Ni powders by a spark plasma sintering process. The WC-5Co, WC-5Fe, and WC-5Ni hard materials are almost completely densified with a relative density of up to 99.6% after simultaneous application of a pressure of 60 MPa and an electric current for about 15 min without any significant change in the grain size. The average grain size of WC-5Co, WC-5Fe, and WC-5Ni that was produced through SPS was about 0.421, 0.779, and 0.429 μm, respectively. The hardness and fracture toughness of the dense WC-5Co, WC-5Fe, WC-5Ni hard materials were also investigated.

In this study, Fe-Cu-C alloy is sintered by spark plasma sintering (SPS). The sintering conditions are 60 MPa pressure with heating rates of 30, 60 and 9oC/min to determine the influence of heating rate on the mechanical and microstructure properties of the sintered alloys. The microstructure and mechanical properties of the sintered Fe-Cu-C alloy is investigated by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FE-SEM). The temperature of shrinkage displacement is changed at 450oC with heating rates 30, 60, and 90oC/min. The temperature of the shrinkage displacement is finished at 650oC when heating rate 30oC/min, at 700oC when heating rate 60oC/min and at 800oC when heating rate 90oC/min. For the sintered alloy at heating rates of 30, 60, and 90oC/min, the apparent porosity is calculated to be 3.7%, 5.2%, and 7.7%, respectively. The hardness of the sintered alloys is investigated using Rockwell hardness measurements. The objective of this study is to investigate the densification behavior, porosity, and mechanical properties of the sintered Fe-Cu-C alloys depending on the heating rate.

Cu-Mn compacts are fabricated by the pulsed current activated sintering method (PCAS) for sputtering target application. For fabricating the compacts, optimized sintering conditions such as the temperature, pulse ratio, pressure, and heating rate are controlled during the sintering process. The final sintering temperature and heating rate required to fabricate the target materials having high density are 700oC and 80oC/min, respectively. The heating directly progresses up to 700oC with a 3 min holding time. The sputtering target materials having high relative density of 100% are fabricated by employing a uniaxial pressure of 60 MPa and a sintering temperature of 700oC without any significant change in the grain size. Also, the shrinkage displacement of the Cu-Mn target materials considerably increases with an increase in the pressure at sintering temperatures up to 700oC.

This study attempted to manufacture a Cu-Ga coating layer via the cold spray process and to investigate the applicability of the layer as a sputtering target material. In addition, changes made to the microstructure and prop- erties of the layer due to annealing heat treatment were evaluated, compared, and analyzed. The results showed that coating layers with a thickness of 520 mm could be manufactured via the cold spray process under optimal conditions. With the Cu-Ga coating layer, the α-Cu and Cu3Ga were found to exist inside the layer regardless of annealing heat treatment. The microstructure that was minute and inhomogeneous prior to thermal treatment changed to homogeneous and dense with a more clear division of phases. A sputtering test was actually conducted using the sputtering target Cu- Ga coating layer (~2 mm thickness) that was additionally manufactured via the cold-spray coating process. Consequently, this test result confirmed that the cold sprayed Cu-Ga coating layer may be applied as a sputtering target material.