This study develops a highly transparent ohmic contact scheme using indium oxide doped ZnO (IZO)as a current spreading layer for p-GaN in order to increase the optical output power of nitride-based light-emitting diodes (LEDs). IZO based contact layers of IZO, Ni/IZO, and NiO/IZO were prepared by e-beamevaporation, followed by a post-deposition annealing. The transmittances of the IZO based contact layers werein excess of 80% throughout the visible region of the spectrum. Specific contact resistances of 3.4×10−4,1.2×10−4, 9.2×0−5, and 3.6×10−5Ω·cm2 for IZO, Ni/Au, Ni/IZO, and NiO/IZO, respectively were obtained. Theforward voltage and the optical output power of GaN LED with a NiO/IZO ohmic contact was 0.15V lower andwas increased by 38.9%, respectively, at a forward current of 20mA compared to that of a standard GaN LEDwith an Ni/Au ohmic contact due to its high transparency, low contact resistance, and uniform current spreading.

This study develops a highly transparent ohmic contact using phosphorus doped ZnO with current spreading for p-GaN to increase the optical output power of nitride-based light-emitting diodes (LEDs). The phosphorus doped ZnO transparentohmic contact layer was prepared by radio frequency magnetron sputtering with post-deposition annealing. The transmittance ofthe phosphorus doped ZnO exceeds 90% in the region of 440nm to 500nm. The specific contact resistance of the phosphorusdoped ZnO on p-GaN was determined to be 7.82×10-3Ω·cm2 after annealing at 700oC. GaN LED chips with dimensions of300×300µm fabricated with the phosphorus doped ZnO transparent ohmic contact were developed and produced a 2.7Vincrease in forward voltage under a nominal forward current of 20mA compared to GaN LED with Ni/Au Ohmic contact.However, the output power increased by 25% at the injection current of 20mA compared to GaN LED with the Ni/Au contactscheme.