The natures of fatigue crack growth under Mode Ⅱ loading are studied. End notched flexure beam specimens were used. The effects of adherend thickness, rubber modification and adhesive thickness on fatigue crack growth were examined. The experimental results show that some of these parameters apparently do affect fatigue crack growth. Resistance to ModeⅡ fatigue crack growth are increased by rubber modification. The effects of adhesive thickness and rubber content on fatigue crack growth were explained by von Mises's equivalent stress using BEM analysis. For unmodified epoxy adhesives, the fatigue crack growth properties under Mode Ⅱ loadings were significantly different in all regions. For rubber-modified epoxy adhesives, they were also different in the first and second regions, but in the third region, they were similar

In this paper, the features of fatigue crack growth under ModeⅠ loading are studied. Double cantilever beam specimens were used. The effects of adherend thickness, rubber modification and adhesive thickness on fatigue crack growth were examined. The experimental results show that some of these parameters do apparently affect fatigue crack growth. Resistance to ModeⅠ fatigue crack growth are increased by rubber modification. The effects of adhesive thickness and rubber content on fatigue crack growth were explained by von Mises's equivalent stress using BEM analysis.

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160˚C was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.