The increasing number of technology transfers from public research institutes in Korea has led to a growing demand for patent recommendation platforms for SMEs. This is because selecting the right technology for commercialization is a critical factor in business success. This study developed a patent recommendation system that uses technology transfer data from the past 10 years to recommend patents that are suitable for SMEs. The system was developed in three stages. First, an item-based collaborative filtering system was developed to recommend patents based on the similarities between the patents that SMEs have previously transferred. Next, a content-based recommendation system based on TF-IDF was developed to analyze patent names and recommend patents with high similarity. Finally, a hybrid system was developed that combines the strengths of both recommendation systems. The experimental results showed that the hybrid system was able to recommend patents that were both similar and relevant to the SMEs' interests. This suggests that the system can be a valuable tool for SMEs that are looking to acquire new technologies.

This study identifies the commercialization success factors that can be an important indicator for the transfer and commercialization of national R&D results in the agricultural sector. Unlike other industries, the agricultural sector has a non-systematically scaled and processed industrial structure, and R&D is led by government rather than the private sector. Although the quantitative performance of national agricultural R&D, especially the number of patents and publications, has increased rapidly with the quantitative expansion of the government R&D budget, the technology commercialization of the results of agricultural R&D has been accompanied by difficulties for SMEs. Therefore, this study summarized the success factors for commercialization of state-owned technologies presented in previous studies, and based on them, analysed the success factors for commercialization specific to the agricultural sector. It also conducted a questionnaire survey using Delphi and focus group interviews (FGI) with experts from academia, research and industry, and a survey of agricultural companies to derive success factors for commercialization in the agricultural sector using logistic regression analysis. As a result, five indicators with positive correlation and three indicators with negative correlation within technology characteristics, suppliers, adopters, policy and market factors were finally derived as key factors for agricultural commercialization. In the future, it is expected that independent factor analysis of the food and seed sectors, which have independent industry characteristics from the agricultural sector, will be needed.

Background: Chronic low back pain (CLBP) causes morphological changes in muscles, reduces muscle strength, endurance and flexibility, negatively affects lumbar stability, and limits functional activity. Plank exercise strengthens core muscles, activates abdominal muscles, and improves intra-abdominal pressure to stabilize the trunk in patients with CLBP. Objects: We investigated the effect of plank exercise on abdominal muscle thickness and disability in patients with CLBP. Methods: We classified 33 subjects into 2 groups: An experimental (n1=17) and a control group (n2=16). Patients in the experimental group participated in plank exercise and those in the control group participated in stretching exercise. Patients in both groups attended 20-minute exercise sessions thrice a week for 4 weeks. Abdominal muscle thickness in each subject was evaluated ultrasonographically, and disabilities were assessed using the Oswestry disability index (ODI). Results: Four weeks later, abdominal muscle thickness showed a significant increase over baseline values in both groups (p<.05). Patients in the experimental group reported a more significant increase in the thickness of the external oblique muscle than that in the control group (p<.05). ODI scores in the experimental group were significantly lower after intervention than before intervention (p<.05). Conclusion: Plank exercise increases the thickness of the external oblique muscle and reduces disability secondary to mild CLBP. Therefore, plank exercise is needed to improve lumbar stability and functional activity in patients with mild CLBP.

우리나라 도로교통안전 수준은 선진국에 비해 하위권에 속한다. ‘17년까지 자동차 1만대당 교통사고사망자 2.4명, OECD 평균 1.2명 수준으로 OECD 수준으로 달성을 위해 국정과제로 교통안전 선진화 대책 추진 중이다. 도로의 안전성을 객관적·정량적으로 판단하여 효과적인 안전사업 계획 수립을 위해 국내 도로 여건을 반영한 도로안전편람을 개발하고자 한다. 미국의 경우 도로안전편람(2010, AASHTO) 발간을 통해 도로 안전성 향상 사업을 수행하는데 참고하는 기본체계를 확립한 바 있다. 도로안전편람 개발을 위해 이 연구는 일반국도 상 입체교차로를 대상으로 위험도평가모형을 개발하였다. 전국 243개 입체교차로에 대해서 3년간(2011년∼2013) 발생한 교통사고를 조사하였으며, 도로기하구조 특성(입체교차로 유형, 진출입로 길이 등) 및 교통량(주도로, 부도로 등)을 조사하였다. 모형은 음이항회귀모형을 이용하여 사고건수, 준도시/지방부, 본선/램프모형을 구축하였다. 구축된 모형의 정확성 분석을 위해 MAD와 MPB를 이용하였다. 모형구축 결과를 바탕으로 입체교차로의 안전성능함수(SPF)와 사고보정계수(CMF)를 개발하였다. 교통량(주도로, 부도로), 감속차로 최소길이 불만족 개수, 램프형태 등이 입체교차로의 교통사고발생에 주요한 영향을 미치는 것으로 나타났다.

1993년 수립된 국가기간간선도로망 계획(7×9)에 따라 추진되어온 우리나라의 국토간선망 건설은 국민 의 교통애로 해소와 경제성장 및 지역 균형 발전에 크게 기여하여 왔다. 그러나, 최근 들어 사회의 요구가 사회복지 등에 초점이 맞추어지면서 도로건설을 둘러싼 주위환경은 더욱 엄격한 경제적 타당성을 요구하 고 있다. 이러한 사회적 분위기에 따라 국토간선도로망이라 할지라도 과거와 같이 고규격 도로인 고속도 로 건설만으로는 소기의 성과를 달성하기 어려워지고 있으며, 다양한 사업추진 방안 마련이 필요하게 되 었다. 따라서, 본 연구에서는 지역주민의 요구사항을 반영하면서 기존 국도를 활용하여 국가기간망을 건 설함에 따른 효과를 분석하고자 하였다. 국토간선망 중 동서5축의 일부에 해당하는 증평~괴산 구간을 대상으로 고속도로 건설시와 기존 국도를 활용한 자동차 건설시의 공사비, 용지비, 부대비 등의 사업비를 비교하였으며, 지역주민 설문조사를 통해 지역주민이 요구하는 간선도로 수준에 대하여 조사하였다. 연구 결과, 고속도로 건설시 42.7km에 16,914 억원에 이르는 공사비는 자동차전용도로 건설을 통해 1,295억원으로 절감이 가능하였으며 지역주민들은 통행료가 없는 자동차전용도로 건설을 더욱 선호하고 있는 것으로 나타나 향후 국가기간망 건설시 교통수 요가 적은 오지 지역의 경우 기존 국도 활용을 적극적으로 검토하는 것이 필요할 것으로 판명되었다.

기존 건축물의 구조 안전성평가와 보수 보강 시에는 해당 건축물의 상태를 정확히 알기 위해 현장 또는 실험실에서의 실험을 수행하는 경우가 많고 최초설계 단계와 다르게 시공된 건축물의 실제 상태 등을 구조해석 모델에 반영하게 된다. 이 경우, 각종 실험값을 전통적인 통계학적 방법은 구조기술자가 지닌 경험과 지식은 구조모델링 및 해석에서 아무런 가치를 더할 수가 없다. 본 논문은 현장 및 실험실에서 얻은 단순한 실험값을 구조기술자의 축적된 경험과 지식을 변수로 활용하여 보다 유효하게 구조해석 모델에 필요한 데이터로 개선하는 방법으로서 통계학적인 베이스 경신법을 이용한 안전성평가 방법에 대해 살펴보았다. 구조기술자의 적절한 판단이 변수로서 포함되면 적은 개수의 샘플 수로도 비교적 정확한 값의 최종 예측값을 산정할 수 있어 전통적인 통계학적 접근에 비해 보다 실제값에 근접한 예측값을 구할 수 있는 것을 확인하였다.

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160˚C was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

As the quality of a weld joint is strongly influenced by process parameters the welding process, an intelligent algorithms that can predict the bead geometry and shape to accomplish the desired mechanical properties of the weldment should be developed. In this study, prepared by Φ1.6mm GMA welding of metal wire nose Advice jowelui 350A 600A grade level inverter welder and DAIHEN SCR's were carried out using welding. Welding conditions were 5.5m/min wire feed rate the welding current is rapidly transmit approximately 260A, welding voltage was about 30V. CTWD a 22mm, shielding gas was Ar 20L/min and the welding speed was a 240mm/min. Using data collected during welding equipment welding current and welding voltage waveform was analyzed by measuring the volume of the transition mode. Addition of CaCO3 as a loss of the spread of the weld bead dilution rate decreased, suggesting that, GMA in the overlay welding bead shape control, dilution control and may be used as a welding flux is considered. Stabilizing effect of the arc by the Ca-containing CaF2, CaCO3, CaMg(CO3)2, respectively, welding flux 0.1wt.% added GMA welding and weld overlay were evaluated with dilution, CaF2, and CaMg(CO3)2 added to the dilution of Seemed to increase.

Nondestructive instrumented indentation test is the method to evaluate the mechanical properties by analyzing load - displacement curve when forming indentation on the surface of the specimen within hundreds of micro-indentation depth. Resistance spot welded samples are known to difficult to measure the local mechanical properties due to the combination of microstructural changes with heat input. Particularly, more difficulties arise to evaluate local mechanical properties of resistance spot welds because of having narrow HAZ, as well as dramatic changed in microstructure and hardness properties across the welds. In this study, evaluation of the local mechanical properties of resistance spot welds was carried out using the characterization of Instrumented Indentation testing. Resistance spot welding were performed for 590MPa DP (Dual Phase) steels and 780MPa TRIP (Transformation Induced Plasticity) steels following ISO 18278-2 condition. Mechanical properties of base metal using tensile test and Instrumented Indentation test showed similar results. Also it is possible to measure local mechanical properties of the center of fusion zone, edge of fusion zone, HAZ and base metal regions by using instrumented indentation test. Therefore, measurement of local mechanical properties using instrumented indentation test is efficient, reliable and relatively simple technique to evaluate the tensile strength, yield strength and hardening exponent.

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

The relationship between the addition of metallic additives and the geometry of gas metal arc weld deposit were studied by using Φ1.6mm flux-cored wire designed for hypo-eutectic Fe-Cr-C-Si hardfacing. It was found that the addition of metallic additives, such as Mn, Ti, Al and Si, by less than 0.5wt.% of the overall wire weight affected the dilution of weld deposit by changing the metal transfer mode during welding. The lowest dilution for each additives could be obtained at the transition point between spray and short circuit modes. The bead width was considered to be affected by the increase of arc length due to the oxidizing effect and by the molten pool flow behavior due to the Marangoni effect. Among additives, Mn and Al are considered to be effective in increasing bead width by decreasing the sulfur level and by inducing Marangoni flow directly at the molten pool, respectively.