Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160˚C was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

In this study, we reported the microstructure and properties of Ag- contact materials fabricated by a controlled milling process with subsequent consolidation. The milled powders were consolidated to bulk samples using a magnetic pulsed compaction process. The nano-scale phases were distributed homogeneously in the Ag matrix after the consolidation. The relative density and hardness of the Ag- contact materials were 95~96% and 89~131 Hv, respectively.

Electro-Discharge Sintering (EDS) employs a high-voltage/high-current-density pulse of electrical energy, discharged from a capacitor bank, to instantaneously consolidate powders. In the present study, a single pulse of 0.57-1.1 kJ/0.45 g-atomized spherical powders in size range of 10~30 and consisting of -(Ti, Zr) and icosahedral phases were applied to examine the structural evolution of icosahedral phase during EDS. Structural investigation reveals that high electrical input energy facilitates complete decomposition of icosahedral phase into C14 laves and -(Ti, Zr) phases. Moreover, critical input energy inducing decomposition of the icosahedral phase during EDS depends on the size of the powder. Porous Ti and W compacts have been fabricated by EDS using rectangular and spherical powders upon various input energy at a constant capacitance of in order to verify influence of powder shape on microstructure of porous compacts. Besides, generated heat () during EDS, which is measured by an oscilloscope, is closely correlated with powder size.

The RFID (Radio-Frequency Identification) is an automatic identification method, relying on storing and remotely retrieving data using devices called RFID tags or transponders. Some RFID tags have been used in severe environment of temperature ranged from to for a long time and may cause serious problems such as signal error, short life cycle and explosion. Conventionally, the RFID tags for high temperature applications consisted of Fe-alloy housing part, ceramic powder and RFID sensor. However, it has disadvantage of heavy weight, signal noise and heat shield capability. In this study, we newly applied the aluminum porous materials fabricated by polymer leaching process into RFID tags in order to improve heat shielding ability, and compared the properties of RFID tag inserted by aluminum porous with the conventional one.

Nine districts in Seoul were chosen randomly and a questionnaire containing 23 questions was distributed to survey the perception of noise pollution by the citizens. The results were primarily analyzed to understand the perception of Seoul citizen as a whole, and then analyzed according to 4 demographic variables -district area, age, gender and occupation -to see if there were any possible relation between nonnoise variables and noise annoyance. Actual noise level data measured by the city government were used to compare quantified noise level with the surveyed people`s perception. It was found that people consider road traffic noise to be the main source of noise pollution in Seoul and that most people have experienced annoyance in everyday life. Also it was verified that the responsibility for noise control should be on both city government and the individuals, but it was generally considered that very little effort is actually put into solving noise pollution from both groups. From the survey, it could be analyzed that demographic variables do affect people in the awareness of noise pollution, and that one`s sensitivity and annoyance due to noise increase as one ages. From the study, it was concluded that noise pollution is not considered currently as a hazardous problem to most Seoul citizens, however specific noise reduction policies, especially regarding road traffic noise, should be put into practice in the near future.