This study has assessed mechanical bonding strength of lead-free solder joint. Assessment methods was performing long-term reliability test about thermal shock, thermal life and high temperature & high humidity. Based on the results of analyzing mean values that was obtained from repetion of 5 times according to each conditions, reduction of mechanical bonding strength of each tests was confirmed. When it comes to HB chip, the order of high deviation rate was shown thermal shock, high temperature & humidity and thermal life. And the higher deviation rate of R0 is high temperature & humidity, thermal life and thermal shock. The order of high deviation rate of C1 chip is high temperature & humidity, thermal shock and thermal life. Related to this result of experiment, the most stable error range of mechanical bonding strength is established. From now on optimized quantity of solder and shape of solder-joint is needed by establishing a test method which can make error range of mechanical bonding strength minimize.