The PCHE(Printed Circuit Heat Exchanger)-type heat exchanger, which was fabricated by etching and diffusion bonding, was used to hydrogen station, VHTR(Very High Temperature Reactor), SMR and so on. The hydrogen station equipped with PCHE-type heat exchanger is necessary to inject the hydrogen gas into facilities, for instance, such as HFCV(Hydrogen Fuel Cell Vehicle) and power systems. The purpose of this study is to investigate the thermal characteristics of thin plate of PCHE depending on constraint conditions through numerical analysis. As the results, it showed that thermal stress of thin plate, which was not performed diffusion bonding at all, was larger than that, which was performed perfect diffusion bonding, and its maximum difference was about 3 times. Further it was confirmed that the thermal characteristics of thin plate could be obtained by investigating the heat flux.