본 연구에서는 폴리비닐알콜(PVA)와 폴리프로필렌글리콜(PPG)기반의 창상피복용 수분산 폴리우레탄수지를 합성하였으며, 시료의 물리적 특성을 필름 시료와 피혁(Full-Grain) 표면에 코팅을 하여 물리적 특성 변화를 연구하였다. 인장강도의 경우 PVA가장 적게 반응된 PUD-PA1 2.00 kgf/㎟ 으로 가장 높은 저항성을 보였으며. 마찬가지로 연실율은 PVA가장 적게 반응된 PUD-PA1가 554%로 높게 측정되었다. 내마모성 측정 결과 PVA 반응이 증가함에 따라 표면의 강도나 낮게 36.77 ㎎.loss로 감소 됨을 알수 있었다.
Microstructure evolutions of thermosetting resin coating layers fabricated by electrostatic spray deposition (ESD) at various processing conditions were investigated. Two different typical polymer systems, a thermosetting phenol-formaldehyde resin and a thermoplastic polyvinylpyrrolidone (PVP), were employed for a comparative study. Precursor solutions of the phenol-formaldehyde resin and of the PVP were electro-sprayed on heated silicon substrates. Fundamental differences in the thermomechanical properties of the polymers resulted in distinct ways of microstructure evolution of the electro-sprayed polymer films. For the thermosetting polymer, phenol-formaldehyde resin, vertically aligned micro-rod structures developed when it was deposited by ESD under controlled processing conditions. Through extensive microstructure and thermal analyses, it was found that the vertically aligned micro-rod structures of phenol-formaldehyde resin were formed as a result of the rheological behavior of the thermosetting phenol-formaldehyde resin and the preferential landing phenomenon of the ESD method.
To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.