From a viewpoint of heat stress at high temperatures and contact thermal resistance, it is confirmed that the optimal structure is the skeleton structure using Cu substrate on the cooling side, which has excellent heat conductivity and the optimal installation method is to adopt a carbon sheet and a mica sheet to the high temperature side, where Si grease is applied to the low temperature side, under pressurized condition. The power of the developed modules indicated 0.5W in an module and 3.8 W with a SiGe module at 823K, respectively.