For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.

Copper infiltration is demonstrated as a viable solution to achieve higher mechanical properties by filling the interconnected porosities of a ferrous structure with copper infiltrant. This paper will present the results of a design of experiments study based on the selected processing variables in the copper infiltration process. The variables are the following: Infiltrating temperatures, infiltrating time at pre-heat zone and hot zone, the green density of iron part, the migration of copper into the iron part at different processing conditions. The results show the flexibility of the infiltration process to attain certain mechanical properties by changing the processing conditions.

Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

The thermal dissipation performance of sintered heat pipes is usually determined by the capillarity and permeability of the Cu powder wicks. Since the capillary provided by the Cu powder is usually large enough to draw water from the condenser end to the evaporator end, the permeability has become the controlling factor. In this study, Cu powders with different particle sizes and shapes were loosely sintered, and their permeabilities were compared. The results show that more complicated shapes, finer particle sizes, lower porosities, and rougher pore surfaces give lower permeability and thermal dissipation.

We present a systematic study of the heating and pre-sintering behavior of porous copper powder metal compacts. We employ a TE102 single mode microwave system to position the samples in the separated electric field (E) or magnetic field (H) anti-node of the cavity. We observe significant differences in the heating, pre-sintering, and microstructure evolution of the samples due to the individual fields. We note that sample history (whether heated first in the E-field or H-field) greatly effects a difference in heating trends and subsequent heating behavior and does not appear to be solely a thermal process.

A hyrdrothermal synthesis has been developd to prepare rod-like crystals of copper oxide using copper nitrate trihydrate as a function of synthesis temperature, stirring speed and solution pH value. The properties of the fabricated crystals were studied using scanning electron microscopy, X-ray diffraction and particle size analysis. The morphology of the synthesized CuO was dependent on both the pH value of the solution and the morphology of the seed materials. Synthesized particles have regular morphologies and a uniform size distribution.

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smooths the composition gradient. Perspectives to control this migration are discussed.

The antimicrobial activity of metallic nanoparticles against bacteria was investigated. Silver, copper, and titania nanoparticles were tested. The bacteria species E. coli and B. subtilis were selected as models for Gram-negative and Gram-positive bacteria, respectively. Bacteriological tests were performed in Luria-Bertani (LB) medium or Nutrient (NT) medium on solid agar plates containing different concentrations of nanoparticles in the range of 0 to 150 μg/mL. Silver and copper nanoparticles were shown to be an effective bactericide. However, titania nanoparticles were found to be ineffective as an antimicrobial agent. It appears that E. coli cells are more sensitive to the copper nanoparticles than to silver nanoparticles and B. subtilis cells have similar sensitivity against both copper and silver nanoparticles.

Ultrafine copper powder was prepared from slurry with hydrazine, a reductant, under . The influence of various reaction parameters such as temperature, reaction time, molar ratio of , PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of and the temperature. When the ratio of was higher than 2.5 and the temperature was higher than , CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about