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BGA 검사 소켓 핀의 불량 분석 연구 KCI 등재 SCOPUS

Failure Analysis of BGA Test Socket Pins

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한국재료학회지 (Korean Journal of Materials Research)
한국재료학회 (Materials Research Society Of Korea)
초록

BGA test sockets failed earlier than the expected life-time due to abnormal signal delay, shown especially at the low temperature (-50˚C). Analysis of failed sockets was conducted by EDX, AES, and XRD. A SnO layer contaminated with C was found to form on the surface of socket pins. The formation of SnO layer was attributed to the repeated Sn transfer from BGA balls to pin surface and instant oxidation of fresh Sn. As a result, contact resistance increased, inducing signal delay. Abnormal signal delay at the low temperature was attributed to the increasing resistivity of Sn oxide with decreasing temperature, as manifested by the resistance measurement of SnO2.

저자
  • 김명식 | Kim, Myung-Sik
  • 배규식 | 배규식