In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 °C, die bonding and isothermal heat treatment at 330 °C for 5 min and wire bonding at 260 °C, respectively. At the interface between the chip and lead frame, Ni3Sn4 and Ag3Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni3Sn4 and Ag3Sn IMCs. After the wire bonding process, the interface is composed of Ni3Sn4, Ag3Sn and (Ag,Cu)3Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

1. 서 론
2. 실험 방법
3. 결과 및 고찰
4. 결 론
Acknowledgement
References
<저자소개>

• 최여진(금오공과대학교 신소재공학과) | Yeo Jin Choi (Department of Advanced Materials Science and Engineering, Kumoh National Institute of Technology, Gumi 39177, Republic of Korea)
• 백승문(금오공과대학교 신소재공학과) | Seung Mun Baek (Department of Advanced Materials Science and Engineering, Kumoh National Institute of Technology, Gumi 39177, Republic of Korea)
• 이유나(금오공과대학교 신소재공학과) | Yu Na Lee (Department of Advanced Materials Science and Engineering, Kumoh National Institute of Technology, Gumi 39177, Republic of Korea)
• 안성진(금오공과대학교 신소재공학과) | Sung Jin An (Department of Advanced Materials Science and Engineering, Kumoh National Institute of Technology, Gumi 39177, Republic of Korea) Corresponding author