In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 °C, die bonding and isothermal heat treatment at 330 °C for 5 min and wire bonding at 260 °C, respectively. At the interface between the chip and lead frame, Ni3Sn4 and Ag3Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni3Sn4 and Ag3Sn IMCs. After the wire bonding process, the interface is composed of Ni3Sn4, Ag3Sn and (Ag,Cu)3Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

HBD(Hot Box Detector) is a device to monitor temperature rises to inappropriate lubricant use or mechanical defects. If a train operates without recognizing such an effect, it might result in bearing overheating due to defects and cause a dangerous situation that it could derail a train owing to the damage of axles. Now for the Gyeongbu HSL at 300km/h, the laws related to monitoring overheated axle bearings are notified in the Railway Safety Law and the Railway Construction Law. But in case of the conventional speed-up lines that a train operates at 180 to 230 km/h, the revised bill of relevant standards is ongoing. Therefore in this paper we present references and reviews investigated in order to use the optimal HBD in the conventional speed-up lines.