The paper investigates the possibility to avoid extrinsic embrittlement of , also increasing the high temperature strength, by alloying with both Fe - of a high strengthening effect and Cr - able to remove a part of diffused oxygen along the grain boundaries. As Cr homogenization in is difficult because of its low diffusion coefficient, for its improving a mechanical alloying (MA) step before the compound synthesis by Self-propagating High-temperature Synthesis (SHS) was adopted. The obtained better homogenization resulted in higher mechanical resistance and deformability than of the unalloyed alloys of the same composition obtained without MA step.

Considering the idea that some properties, especially the mechanical properties of at ambient temperature can be improved by adding of some substitutional/interstitial elements, our goal was to obtain these materials starting from mechano-composites powders. In this aim, using mechanical alloying techniques three type of mechano-composite powders starting from elemental powders were obtained. Then, by reactive sintering in argon atmosphere at temperature over , alloyed materials were realized. This paper presents our research results regarding the microstructural aspects and phase formation in obtained materials.

Behavior of stoichiometric and near-stoichiometric NiAl at plasma spray deposition, without and with a bond coat, for coating layers realization on a low alloyed steel substrate, has been investigated. In all variants, NiAl particle melting and subsequent welding at the impact with substrate were observed, forming a relatively compact and adherent coating layer with the NiAl stability maintaining - all assuring the coating layer oxidation and corrosion resistance. Good results from these points of view, also validated through corrosion tests, were obtained for 45:55 Ni:Al composition without a bond coat but adopting an Ar protective surrounding of plasma jet.

The paper presents some results regarding the obtaining of some copper heat pipes with a porous copper internal layer for electronic components cooling. The heat pipes were realized by sintering of spherical copper powders of size directly on the internal side of a copper pipe of 18 mm in diameter. The obtained pipes were then brazed in order to obtain a heat pipe of 0.5 m in length. After that, the heat pipe was sealed and filled with a small quantity of distilled water as working fluid. To establish the total heat transport coefficient and the thermal flow transferred at the evaporator, some external devices were realized to allow the heating of the evaporator and the cooling of the condenser. Water heat pipes are explored in the intermediate temperature range of 303 up to 500 K. Test data are reported for copper water heat pipe, which was tested under different orientations. The obtained results show that the water heat pipe has a good thermal transfer performance in the temperatures range between 345 and 463 K.