Silicon carbide (SiC) has emerged as a promising material for next-generation power semiconductor materials, due to its high thermal conductivity and high critical electric field (~3 MV/cm) with a wide bandgap of 3.3 eV. This permits SiC devices to operate at lower on-resistance and higher breakdown voltage. However, to improve device performance, advanced research is still needed to reduce point defects in the SiC epitaxial layer. This work investigated the electrical characteristics and defect properties using DLTS analysis. Four deep level defects generated by the implantation process and during epitaxial layer growth were detected. Trap parameters such as energy level, capture-cross section, trap density were obtained from an Arrhenius plot. To investigate the impact of defects on the device, a 2D TCAD simulation was conducted using the same device structure, and the extracted defect parameters were added to confirm electrical characteristics. The degradation of device performance such as an increase in on-resistance by adding trap parameters was confirmed.

산소분압과 온도변화에 따라 비양론성 rutile(TiO2-x)의 결함모델을 전기전도 측정법에 의해 연구하였다. 산소분압과 전기전도도의 상관관계에 의하면, rutile에서 주결함은 2가로 하전된 산소빈자리와 4가로 하전된 침입형 티타늄이온이다. 1170˚C이상의 온도에서는 침입형 Tii…이온이 지배적인 결함이었으나, 1170˚C이하의 낮은 산소분압대에서는 2가로 하전된 산소빈자리가 주된 결함이었다. rutile의 전기전도 실험에서 제안된 결함모델은 본 연구팀이 O18추적자 확산실험에 의해 제안하였던 결과치와 일치하였다.