In this study, Bacillus sp. SRCM 112835 was isolated from soybean paste (Doenjang, Korean Fermented Soy Paste). Bacillus sp. SRCM 112835 showed biosorption of the Cu (II) in aqueous solution. The strain effectively absorbed 30.2% of the Cu (II) from a 52.3 mg/L within 60 min. The properties of the Bacillus sp. SRCM 112835 were investigated by Fourier transform infrared spectroscopy (FT-IR), point of zero charge (pHpzc), and phylogenetic analysis. The influence of initial pH (2.08-9.98) and biomass dosage (0.005-0.07 g) were likewise probed. Isotherm and kinetic experiment results suggested that the Langmuir isotherm and pseudo-second-order kinetic models well-fitted the experimental data, respectively.

This study investigates Ag coated Cu2O nanoparticles that are produced with a changing molar ratio of Ag and Cu2O. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and Cu2O determination, and SEM image analysis confirms that Ag is partially coated on the surface of Cu2O nanoparticles. The conductive paste with Ag coated Cu2O nanoparticles approaches the specific resistance of 6.4 Ω·cm for silver paste(SP) as (Ag) /(Cu2O) the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of 100 μm or less has a surface resistance of 5 to 20 μΩ·cm, while in this research an Ag coated Cu2O paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of 10 μm or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.