동일 문화권에서의 문화성향(개인주의 vs. 집단주의)-내외 통제소재(내통제 vs. 외통제) 조합 유형에 따라 복합 자극에 대한 전역/국소 처리에서 차이가 있는지 검토하기 위해 자극 유형(복합도형과 복합문자)과 자극-자극 속성 일치 여부가 조작된 실험조건에서 실험참가자들이 보인 반응시간과 오반응률을 비교하였다. 본 연구의 주요 결과를 요약하면 다음과 같다. 첫째, 자극-자극 속성이 일치하는 조건에서의 전역 처리가 가장 빨랐던 반면, 자극-자극 속성 불일치 조건에서의 국소 처리가 가장 느렸다. 둘째, 복합문자에 비해 복합도형에 대한 반응시간이 더 짧았다. 셋째, 복합도형과는 달리 복합문자의 경우 두 가지 문화성향 모두에서 내적 통제소재보다는 외적 통제소재 경향의 실험참가자들에게서 전역선행성이 관찰되었다. 이런 결과는 동일한 문화권인 경우, 문화성향보다는 내외 통제소재와 같은 성격요인에서의 개인차가 전역/국소 처리에서의 차이를 더 민감하게 반영할 수 있다는 것과, 이런 개인차 변인은 지각수준보다는 좀 더 고차의 인지수준에 관여한다는 것을 시사한다.

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

  This paper proposes an object-oriented software development guidance and an evaluation index for the productivity related to EJB(Enterprise JavaBeans). EJB is a known successful standard model for LSDO(Large Size Distributed Object). However, there is n

Bao Loc City is the new tourism destination in Lam Dong province, Vietnam, where more and more tourists have been drawn to pay a visit. This study aims to test the correlative impact of tourism service quality factors on satisfaction of the tourists who have visited Bao Loc City. The key theory used in this study is SERVQUAL scale. The survey sample consists of 350 tourists who stayed overnight in Bao Loc City in the last quarter of 2019; 315 valid survey questionnaires could be used for the analysis. The research applied Cronbach’s Alpha, exploratory factor analysis (EFA), confirmatory factor analysis (CFA), structural equation modeling (SEM), and bootstrap test. The results show that the satisfaction of the tourists who have visited Bao Loc City has been affected statistically by three factors: (1) Responsiveness; (2) Reliability; and (3) Empathy, which were ranked by descending importance. Surprisingly, the research found that Tangibles and Assurance do not have an impact on tourists’ satisfaction towards Bao Loc City. The research formulates some suggestions to the city policy-makers and the tourism businesses management in Bao Loc City in order to enhance tourists’ satisfaction through improving the tourism service quality at Bao Loc City.