We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

In this study, we used I-V spectroscopy, photoconductivity (PC) yield and internal photoemission (IPE) yield using IPE spectroscopy to characterize the Schottky barrier heights (SBH) at insulator-semiconductor interfaces of Pt/HfO2/p-type Si metal-insulator-semiconductor (MIS) capacitors. The leakage current characteristics of the MIS capacitor were analyzed according to the J-V and C-V curves. The leakage current behavior of the capacitors, which depends on the applied electric field, can be described using the Poole-Frenkel (P-F) emission, trap assisted tunneling (TAT), and direct tunneling (DT) models. The leakage current transport mechanism is controlled by the trap level energy depth of HfO2. In order to further study the SBH and the electronic tunneling mechanism, the internal photoemission (IPE) yield was measured and analyzed. We obtained the SBH values of the Pt/HfO2/p-type Si for use in Fowler plots in the square and cubic root IPE yield spectra curves. At the Pt/HfO2/p-type Si interface, the SBH difference, which depends on the electrical potential, is related to (1) the work function (WF) difference and between the Pt and p-type Si and (2) the sub-gap defect state features (density and energy) in the given dielectric.

Au/Si(100) Schotty diode를 l00k~300k 온도범위에서 current voltage(I-V), capacitance-voltage(C-V)측정을 하였다. 얻어진 Schottky barrier height(SBH)갑은 실온에서 두측정값 모두 (0.79±0.02)eV 이다. 그러나 온도가 감소할수록 I-V측정에서 SBH는 선형적으로 감소하고 C-V측정에서 SBH는 온도에 따른 변화가 관찰되지 않았다. 이것은 낮은 온도에서 열이온 방출 이론을 따르지 않는다는 것을 나타낸다. 이것으로 재결합 전류를 고려하여 계산해 본 결과 I-V에서도 SBH의 변화가 관찰되지 않으므로 C-V측정과 일치됨을 보았다. 이런 상반된 결과를 가져오는 이유는 전류수송현상이 온도에 따라 변화하므로 생긴 것임을 알 수 있었다.