Automobiles are an essential means of transporting passengers and cargo, but traffic accidents are inevitable in their operation. These accidents can occur in various forms, such as front, rear, and side collisions. The resulting damage to the vehicle can also be seen similarly; it is inherently distinct: the complexity of repairing the car body makes a simple reliance on textbook knowledge insufficient. Successful correction of the damaged body largely depends on the experience of the practitioner. Discussions on body repair techniques should be based on empirical data reflecting current industry standards and associated costs. The variability of individual repair methodologies can result in significant time and financial expenditure in the field of automotive bodies. Application of new material technologies to vehicle fabrication requires continuous training and empirical research, especially on the body repair process involving new materials. In particular, since the left and right aprons and side members are made of different materials, such as aluminum and high-strength steel, careful restoration of these parts is required. Technical considerations are needed. Interest in safety and environmental impacts. In this study, SPR bonding technology analyzes experimental results.

As the time and cost of body repair can be greatly incurred due to differences in individual technologies, body repair technology should be discussed based on data on general working standards and costs, and as new material technology is applied to the body, continuous learning and experiment on vehicle body repair technology is essential. Since the left and right apron and side members with SPR bonding technology are made of different materials, aluminum and high-strength steel, the restoration of the left and right apron side members should be considered technically, as well as safety and environmental pollution. In this study, we experiment with heterogeneous apron and side members applied with SPR bonding and analyze the results.

To realize large-format compact array detectors covering a wide far-infrared wavelength range up to 200 μm, we have been developing Blocked-Impurity-Band (BIB) type Ge detectors with the room- temperature surface-activated wafer bonding technology provided by Mitsubishi Heavy Industries. We fabricated various types of p+-i junction devices which possessed a BIB-type structure, and evaluated their spectral response curves using a Fourier transform spectrometer. From the Hall effect measurement, we also obtained the physical characteristics of the p+ layers which constituted the p+-i junction devices. The overall result of our measurement shows that the p+-i junction devices have a promising applicability as a new far-infrared detector to cover a wavelength range of 100-200 μm.