In this study, changes in the microstructure and mechanical properties of cast and extruded Al-2Li-1Ce alloy materials were investigated as the Mg content was varied. The density decreased to 2.485, 2.46 and 2.435 g/cm3 when the Mg content in the Al-2Li-1Ce alloy was increased to 2, 4 and 6 wt%, respectively. Intermetallic compounds of Al11Ce3 were observed in all alloys, while the β-phase of Al3Mg2 was observed in alloys containing 6 wt% of Mg. In the extruded material, with increasing Mg content the average grain size decreased to 84.8, 71.6 and 36.2 μm, and the fraction of high-angle grain boundaries (greater than 15°) increased to 82.8 %, 88.6 %, and 91.8 %, respectively. This occurred because the increased Mg content promotes dynamic recrystallization during hot extrusion. Tensile test results showed that as the Mg content increased, both the yield strength and tensile strength increased. The yield strength reached 86.1, 107.3, and 186.4 MPa, and the tensile strength reached 215.2, 285, and 360.5 MPa, respectively. However, it is worth noting that the ductility decreased to 27.78 %, 25.65 %, and 20.72 % as the Mg content increased. This reduction in ductility is attributed to the strengthening effect resulting from the increased amount of dissolved Mg, and grain refinement due to dynamic recrystallization.

This research investigated how adding Sb (0.75, 1.0, 2.0 and 5.0 wt%) to as-extruded aluminum alloys affected their microstructure, mechanical properties, electric and thermal conductivity. The addition of Sb resulted in the formation of AlSb intermetallic compounds. It was observed that intermetallic compounds in the alloys were distributed homogenously in the Al matrix. As the content of Sb increased, the area fraction of intermetallic compounds increased. It can be clearly seen that the intermetallic compounds were crushed into fine particles and homogenously arrayed during the extrusion process. As the Sb content increased, the average grain size decreased remarkably from 282.6 μm (0.75 wt%) to 109.2 μm (5.0 wt%) due to dynamic recrystallization by the dispersed intermetallic compounds in the aluminum matrix during the hot extrusion. As the Sb content increased from 0.75 to 2.0 wt%, the electrical conductivity decreased from 61.0 to 59.8 % of the International Annealed Copper Standard. Also, as the Sb content increased from 0.75 to 2.0 wt%, the ultimate tensile strength did not significantly change, from 67.3 to 67.8 MPa.