본 연구에서는 공정 간소화, 균일한 나노 입자 형성, 백금 저감 및 활용도를 높이기 위하여 원자층 증착법 (Atomic Layer Deposition, ALD)을 통하여 양이온 교환막 연료전지용 촉매를 제조하고 증착 온도에 따른 백금 입자 형성 거동 을 확인하였다. 증착 온도는 250 °C, 300 °C, 350 °C로 조절하여 백금 촉매를 형성하였으며 각 각의 촉매의 증착 양 상을 확인하기 위하여 Thermogravimetric analysis, X-ray diffraction 및 Transmission electron microscopy를 도입하여 담지량, 백금 입자 분포, 크기 및 결정구조 등을 확인하였다. 합성된 백금 촉매를 연료전지에 적용하기 위해서 Cyclic Voltammetry 기법을 통해서 전기화학적 활성 표면적를 구하고, Membrane Electrode Assembly 셀을 제작하여 전지 특성을 확보하였다. 최종적으로, 백금 촉매 제조 시 ALD 증착 온도는 300 °C 이하에서 합성해야 됨을 밝혀냈으며, ALD으로 제작된 백금 촉매가 기존 습식 촉매보다 더 우수한 특성을 보임을 확인하였다. 해당 연구는 ALD을 통하여 다양한 접근법으로 촉매를 제조할 시, 기본적인 ALD 공정 정보 및 ALD 촉매 합성 방향성을 제공할 수 있다.

Metal three-dimensional (3D) printing is an important emerging processing method in powder metallurgy. There are many successful applications of additive manufacturing. However, processing parameters such as laser power and scan speed must be manually optimized despite the development of artificial intelligence. Automatic calibration using information in an additive manufacturing database is desirable. In this study, 15 commercial pure titanium samples are processed under different conditions, and the 3D pore structures are characterized by X-ray tomography. These samples are easily classified into three categories, unmelted, well melted, or overmelted, depending on the laser energy density. Using more than 10,000 projected images for each category, convolutional neural networks are applied, and almost perfect classification of these samples is obtained. This result demonstrates that machine learning methods based on X-ray tomography can be helpful to automatically identify more suitable processing parameters.

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

Ru films were successfully prepared by plasma-enhanced atomic layer deposition (PEALD) using and plasma. To optimize Ru PEALD process, the effect of growth temperature, plasma power and plasma time on the growth rate and preferred orientation of the deposited film was systemically investigated. At a growth temperature of and plasma power of 100W, the saturated growth rate of 0.038 nm/cycle was obtained on the flat /Si substrate when the and plasma time was 7 and 10 sec, respectively. When the growth temperature was decreased, however, an increased plasma time was required to obtain a saturated growth rate of 0.038 nm/cycle. Also, plasma power higher than 40 W was required to obtain a saturated growth rate of 0.038 nm/cycle even at a growth temperature of . However, (002) preferred orientation of Ru film was only observed at higher plasma power than 100W. Moreover, the saturation condition obtained on the flat /Si substrate resulted in poor step coverage of Ru on the trench pattern with an aspect ratio of 8:1, and longer plasma time improved the step coverage.

This paper describes the results of the application of Cr-Diamond-like carbon (DLC) films for efficiency improvement through surface modification of spur gear parts in the hydraulic gear pump. Cr-DLC films were successfully deposited on SCM 415 substrates by a hybrid coating process using linear ion source (LIS) and magnetron sputtering method. The characteristics of the films were systematically investigated using FE-SEM, nano-indentation, sliding tester and AFM instrument. The microstructure of Cr-DLC films turned into the dense and fine grains with relatively preferred orientation. The thickness formed in our Cr buffer layer and DLC coating layer were obtained the 487 nm and . The average friction coefficient of Cr-DLC films considerably decreased to 0.15 for 0.50 of uncoated SCM415 material. The hardness and surface roughness of Cr-DLC films were measured 20 GPa and 10.76 nm, respectively. And then, efficiency tests were performed on the hydraulic gear pump to investigate the efficiency performance of the Cr-DLC coated spur gear. The experimental results show that the volumetric and mechanical efficiency of hydraulic gear pump using the Cr-DLC spur gear were improved up to 2~5% and better efficiency improvement could be attributed to its excellent microstructure, higher hardness, and lower friction coefficient. This conclusion proves the feasibility in the efficiency improvement of hydraulic gear pump for industrial applications.

In this paper, the effect of electrical characteristics and electrode shape on the alignment and attachment of multi-walled carbon nanotubes (MWNTs) has been studied. The attraction and alignment of MWNTs between the gaps has been investigated by applying electric field which is called electrophoresis and dielectrophoresis. According to the frequency of electric field, positive or negative dielectrophoretic force can be determined. The concentration of MWNTs solution was , and a droplet of was dropped between two electrodes. Through the repeated experiments, the optimal electrical conditions for aligning and attaching MWNTs in the desired places were obtained. Since the frequency range of 100 kHz~10 MHz generated positive dielectrophoretic force, MWNTs were attracted and aligned between the gaps with this frequency range. For generating enough force to attract MWNTs, the appropriate voltage range was . Furthermore, the effect of electrode shape on the alignment of MWNTs was investigated. A single MWNT attachment was accomplished on the round shaped with 70% yield.