In this study, the effect of Sn and Mg on microstructure and mechanical properties of Cu-Fe-P alloy were investigated by using scanning electron microscope, transmission electron microscope, tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases in order to satisfy characteristic for lead frame material. It was observed that Cu-0.14wt%Fe-0.03wt%P-0.05wt%Si-0.1wt%Zn with Sn and Mg indicates increasing tensile strength compare with PMC90 since Sn restrained the growth of the Fe-P precipitation phase on the matrix. However, the electrical conductivity was decreased by adding addition of Sn and Mg because Sn was dispersed on the matrix and restrained the growth of the Fe-P precipitation. The size of 100 nm Mg3P2 precipitation phase was observed having lattice parameter a:12.01Å such that [111] zone axis. According to the results of the study, the tensile strength and the electrical conductivity satisfied the requirements of lead frame; so, there is the possibility of application as a substitution material for lead frame of Cu alloy.

This study looked at high performance copper-based alloys as LED lead frame materials with higher electrical-conductivity and the maintenance of superior tensile strength. This study investigated the effects on the tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases when Cr was added in Cu-Fe alloy in order to satisfy characteristics for LED Lead Frame material. Strips of the alloys were produced by casting and then properly treated to achieve a thickness of 0.25 mm by hot-rolling, scalping, and cold-rolling; mechanical properties such as tensile strength, hardness and electrical-conductivity were determined and compared. To determine precipitates in alloy that affect hardness and electrical-conductivity, electron microscope testing was also performed. Cr showed the effect of precipitation hardened with a Cr3Si precipitation phase. As a result of this experiment, appropriate aging temperature and time have been determined and we have developed a copper-based alloy with high tensile strength and electrical-conductivity. This alloy has the possibility for use as a substitution material for the LED Lead Frame of Cu alloy.

강도, 소전율, 스프링성, 내열성 및 굽힘 가공성등의 적절한 조화를 갖는 콘넥팅재료를 개발하기 위하여 Cu-Ni-Si-P합금에 대하여 연구하였다. Ni와 Si의 조성을 달리한 3종류의 합금을 용해, 주조하여 약 900˚C에 열간압연 후 수냉하고, 그 후 냉간압연하여 450˚C. 500˚C 및 550˚C에서 시효처리한 후 기계적 성질 변화와 도전율 등을 조사하였다. 고강도와 고존도율의 적절한 조화를 나타내는 Cu-2.7%Ni-0.53% Si-0.029%P 합금을 만들었다. 합금 1을 0.5mm두께의 콘넥팅재료로 가공한 후 여러가지 특성은 인청동(C 5210R-H)과 황동(C2600R-EH)에 비해 우수한 것으로 평가되었다.